The evaluation of a plasma-based atomic layer etching (ALE) approach for native oxide surface removal from Si substrates is described. Objectives include removal of the native oxide while minimizing substrate damage, surface residues and substrate loss. Oxide thicknesses were measured using in situ ellipsometry and surface chemistry was analyzed by x-ray photoelectron spectroscopy. The cyclic A...

In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeate...

The work is focused on thin film technologies especially on sputtering of dielectric thin film layers. The set of thin film capacitors was created on silica glass substrate. Aluminum electrodes of separated capacitors are deposited by method of vacuum evaporation. The AlN dielectric layer was prepared by reactive high frequency sputtering from aluminum target in nitrogen atmosphere. Dielectric ...

We investigated the thermal performance of a power semiconductor module used in mobile communication systems. The module contained hetero-junction bipolar transistor (HBT) fingers, which were fabricated on the top of a semiconductor substrate. We calculated the thermal resistance between the HBT fingers and the bottom surface of a multi-layer printed circuit board (PCB) using a finite element m...

We study the amplitude and phase signals detected in infrared scattering-type near field optical microscopy (s-SNOM) when probing a thin sample layer on a substrate. We theoretically describe this situation by solving the electromagnetic scattering of a dipole near a planar sample consisting of a substrate covered by thin layers. We perform calculations to describe the effect of both weakly (Si...

Soft, conformable electrical contacts provide efficient, noninvasive probes for the transport properties of chemically and mechanically fragile, ultrathin organic semiconducting films. When combined with high-resolution printing and lamination techniques, these soft contacts also form the basis of a powerful technique for fabricating flexible plastic circuits. In this approach, a thin elastomer...

The electrochemical activities of PbO(2) thin-film electrodes were systematically studied with an oxygen-transfer reaction, i.e., the oxidation of thiourea. Five different types of PbO(2) film electrodes were prepared using various methods to investigate the influence of the interfacial oxide layer formed between the Ti substrate and the PbO(2) layer contacting the electrolyte. Among the electr...

An instrumentation technique is developed using embedded capacitive sensors to measure the thickness and evenness of coverage of a thin layer of dielectric thermal interface material (TIM) between two substrates. The technique requires an array of sensors embedded into one substrate, with an electrically conductive opposing substrate. Local capacitance measurements are sensitive to both local b...

Extremely thin gold layers were sputter deposited on glass and silicon substrates, and their thickness and morphology were studied by Rutherford backscattering (RBS) and atomic force microscopy (AFM) methods. The deposited layers change from discontinuous to continuous ones for longer deposition times. While the deposition rate on the silicon substrate is constant, nearly independent on the lay...

The Ti/TiN multi-layer film was prepared on the depleted uranium (DU) substrate by cathodic arc ion plating equipment. The character of multi-layer film was studied by SEM, XRD and AES, revealed that the surface was composed of small compact particle and the cross-section had a multi-layer structure. The fretting wear performance under different frequencies was performed by a MFT-6000 machine w...