Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations of tin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements hav...

Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the use of magnetic and capillary forces to self-assemble 280 μm sized silicon building blocks into interconnected structures which approach a three-d...

0026-2714/$ see front matter 2009 Published by doi:10.1016/j.microrel.2009.03.001 * Corresponding author. Tel.: +886 3573 1814; fax: E-mail address: [email protected] (C. Chen). Three dimensional thermo-electrical analysis was employed to simulate the current density and temperature distributions for eutectic SnAg solder bumps with shrinkage bump sizes. It was found that the current crowdin...

The fracture of SAC305 solder was investigated as a function of strain rate using Cu-solder-Cu double cantilever beam (DCB) specimens joined with a series of 2 mm long discrete solder joints of 150 m thickness. The joints were then fractured with various strain rates under mode I and mixed-mode loading conditions. The failure of each joint in the DCB was accompanied by a sharp drop in the appli...

The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form (Cu,Ni)6Sn5 IMC on the Ni pad in Ni-SnAg-Cu solder joint. A little Ni can also be detected in Cu6Sn5 layer, which contains some trapped solder, o...

The authors present a sensor for real-time detection of solder-joint faults in programmed, operational Field Programmable Gate Arrays (FPGAs), especially those FPGAs in Ball Grid Array (BGA) packages, such as a XILINX® FG1156 [1]. FPGAs are used in all manner and kinds of control systems in aerospace applications. The ability to sense high-resistance faults in the solder joints of operational F...

This paper describes the design and construction of an open automated solder bond veri cation machine for the electronics manufacturing industry The application domain is the higher end assembly technologies with an emphasis on ne pitch surface mount components The system serves a measurement function quantifying the solder bonds It interfaces with the manufacturing process to close the manufac...

Title of Document: AN ANALYTICAL MODEL FOR DEVELOPING A CANARY DEVICE TO PREDICT SOLDER JOINT FATIGUE FAILURE UNDER THERMAL CYCLING CONDITIONS Sony Mathew, Ph.D., 2015 Directed By: Professor Michael G. Pecht , Department of Mechanical Engineering Solder joint fatigue failure is a prevalent failure mechanism for electronics subjected to thermal cycling loads. The failure is attributed to the the...

Title of dissertation: FLEX CRACKING AND TEMPERATUREHUMIDITY-BIAS EFFECTS ON RELIABILITY OF MULTILAYER CERAMIC CAPACITORS Mohammadreza Keimasi, Doctor of Philosophy, 2007 Dissertation directed by: Professor Michael Pecht Department of Mechanical Engineering Multilayer ceramic capacitors (MLCCs) are known to be susceptible to cracking when subjected to excessive printed circuit board (PCB) flexu...

In this study, we investigated the microstructure, mechanical properties, and thermal performance of Sn-xBi-1Ag (x = 35, 37, 45, 47 wt.%) solders, with a particular focus on effect adding trace Si atoms. The impact different Ag concentrations properties Sn-xBi-Ag-0.5Si solders was also studied. results indicated that as amount Bi added to solder alloys increased, tensile strength, microhardness...