Solar thermal energy can be captured on absorbent surfaces, but coatings tend to deteriorate, due changes in hue, shocks, or detachment of all layers. There is a great challenge reducing the deterioration because environmental factors such as corrosion, impact, and dust control, among others. The interact with incident solar radiation transforming it heat energy, selectivity allows low emissivi...

A new heat transfer based finite element model is proposed to simulate coating thickness in the electron-beam physical vapor deposition (EB-PVD) process. The major advantage of that it much computationally efficient than traditional ray-tracing by about two orders magnitude. This because Gaussian distribution heating source has same profile as cosine relation used method. Firstly, simulates tem...

We discuss a custom built hybrid physical chemical vapour deposition (HPCVD) system for MgB2 ultra-thin film deposition: construction, deposition process development, and optimization. Achieved films on SiC substrates have a critical temperature (Tc) ranging from 35K (10nm thick films) to 41K (40nm thick films). The 20nm thick unpatterned film had a room temperature resistivity of 13μΩ·cm, wher...

The metallization of porous silicon (PSi) is generally realized through physical vapor deposition (PVD) or electrochemical processes using aqueous solutions. The former uses a strong vacuum and does not allow for a conformal deposition into the pores. In the latter, the water used as solvent causes oxidation of the silicon during the reduction of the salt precursors. Moreover, as PSi is hydroph...

Mechanical robustness, biocompatibility, and antibacterial performance are key features for materials suitable to be used in tissue engineering applications. In this work, we investigated the link existing between structural functional properties of TiCu(Ag) thin films deposited by physical vapor deposition magnetron sputtering (MS-PVD) on Si substrates. Thin were characterized X-ray diffractio...

A semiconductor wafer undergoes a wide range of processes before it is transformed from a bare silicon wafer to one populated with millions of transistor circuits. Such processes include Physical or Chemical Vapor Deposition, (PVD, CVD), Chemical-Mechanical Planarization (CMP), Plasma Etch, Rapid Thermal Processing (RTP), and photolithography. As feature sizes keep shrinking, process control pl...

This paper highlights a number of challenges and solutions developed to meet the needs of MEMS manufacturers using 3D packaging for low I/O count devices. Various process steps, such as, TSV etch, dielectric liner deposition, barrier/seed PVD have been developed and optimized to increase electrical performance, increase throughput and reduce costs for volume production. In particular, various s...

Microbial contamination of medical devices and treatment rooms leads to several detrimental hospital device-associated infections. Antimicrobial copper coatings are a new approach control healthcare-associated infections (HAI’s). This review paper focuses on the efficient methods for depositing highly adherent copper-based antimicrobial onto variety metal surfaces. properties produced by variou...

In this paper, we present a simulation of chemical vapor deposition with metallic bipolar plates. In chemical vapor deposition, a delicate optimization between temperature, pressure and plasma power is important to obtain homogeneous deposition. The aim is to reduce the number of real-life experiments in a given CVD plasma reactor. Based on the large physical parameter space, there are a hugh n...