The high residual stress in a resin-molded electronic package sometimes makes the electronic functions unstable. Therefore the residual stress in electronic packages, especially on the top surfaces of semiconductor chips, should be evaluated. The objective of this study is to present a simple method for evaluating residual stress in resin-molded semiconductor chips using a combination of experi...

The Food and Drug Administration (FDA) is conducting research on developing reference lung cancer lesions, called phantoms, to test computed tomography (CT) scanners and their software. FDA loaned two semi-spherical phantoms to the National Institute of Standards and Technology (NIST), called Green and Pink, and asked to have the phantoms' volumes estimated. This report describes in detail both...

When end use considerations preclude complete utilization of the multifunctional design capabilities of DuPont engineering plastics, components can be joined through a variety of relatively quick and inexpensive assembly techniques. Among them: press and snap fits, cold heading cementing self-tapping screws, heat staking and spin, vibration and sonic welding. There is still another method of jo...

Abstract In this paper, injection molding is used as a method of plastic molding, which in the molten state injected into closed mold cavity by compression, and material fills then cured cooling to maintain shape mold. The basic structural form parameters mold’s parting surface, winding system, system are determined flow analysis. CAE analysis move filling computer, casting system’s design sche...

The wide use of thermoplastics has put higher demands on designers to conduct more accurate and increasingly sophisticated analysis of materials in order to ensure the performance of the molded parts under the end-use conditions characterized by varying humidity, temperature, and dynamic load or deformation. One of the key aspects in thermoplastic analysis is to apply correct material property ...