As it is getting increasingly difficult to achieve gains in the density and power efficiency of microelectronic computing devices because of lithographic techniques reaching fundamental physical limits, new approaches are required to maximize the benefits of distributed sensors, micro-robots or smart materials. Biologically-inspired devices, such as artificial neural networks, can process infor...

Acoustic micro imaging (AMI) is used as an important non-destructive inspection tool in semiconductor reliability evaluation and failure analysis. As advanced microelectronic packages are being produced smaller and thinner, detection of the internal features and defects in the packages are approaching the resolution limits for conventional AMI. Recently acoustic time-frequency domain imaging ha...

References: [1] Microelectronic Circuits, Sedra & Smith [2] Chapter 5 Microelectronic Circuits 5th Solutions Manual Sedra & Smith [3] Art of Electronics Student Manual, [4]Hayes & Horowitz Chapter 3 The Art of Electronics, Horowitz & Hill [4] Chapter 3 JFET Reading [5]this is a big file so download it. Other References [6] Curve Tracer Information at bottom of page Curve TRACER Manual [7] Physi...

This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn– 3.0Ag and Sn–1.0In with that of a baseline Sn–3.0Ag–0.5Cu solder joint under a severe temper...

The manufacture of ultra-large scale integration technology requires many thermal cycles that can impose significant strain within the constituent metallization due to the mismatch in coefficients of thermal expansion between metallization and its surrounding environment. The resulting stress distributions can be large enough to induce voiding within Cu-based metallization, a key reliability is...

This paper describes a ten-year-long technical and social experiment in our department to build a laboratory that designs and fabricates microelectronic systems in support of research in computer architecture. This experiment has been fairly successful by several measures: We have built and demonstrated a number of systems, some of significant size and complexity, spanning a fairly wide range o...

Thermal management in microelectronic devices has become a crucial issue as the devices are more and more integrated into micro-devices. Recently, free-standing graphene films (GFs) with outstanding thermal conductivity, superb mechanical strength, and low bulk density, have been regarded as promising materials for heat dissipation and for use as thermal interfacial materials in microelectronic...

In this paper, we present the design and the measurement of two antennas realized on a 130nm CMOS process. They both radiate in the 60 GHz band and are dedicated to Wireless Personal Area Network (WPAN) applications. The antennas are manufactured within the frame of a multi-wafer project with several surrounding microelectronic circuits. The first antenna is an Inverted-F antenna (IFA). It has ...

With the electronic industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time while satisfying electrical, thermal, and mechanical requirements, as well as cost and manufacturability. In addition, reliability and durability have to be taken into cons...

Abstract: In this paper, a novel integrated high precision vacuum microelectronic accelerometer is put forward based on the theory of field emission, the accelerometer consists of sensitive structure and interface ASIC. The sensitive structure has a mass of a cathode cone tips array, a folded beam, an emitter electrode and a feedback electrode. The sensor is fabricated on a double side polished...