The genetic basis for susceptibility or nonsusceptibility of plants to viruses is understood poorly. Two selectable tobacco etch virus (TEV) strains were developed for identification of Arabidopsis thaliana mutants with either gain-of-susceptibility or loss-of-susceptibility phenotypes. These strains conferred a conditional-survival phenotype to Arabidopsis based on systemic expression of herbi...

Mica can store (for > 1 Gy) etchable tracks caused by atoms recoiling from WIMPs. Because a background from fission neutrons will eventually limit this technique, a unique signature for WIMPs in ancient mica is needed. Our motion around the center of the Galaxy causes WIMPs, unlike neutrons, to enter the mica from a preferred direction on the sky. Mica is a directional detector and despite the ...

This study was designed to evaluate microleakage that appeared on Resin-Modified Glass-Ionomer Cement (RMGIC) restorations. Sixty class V cavities (h x w x l = 2 mm x 2 mm x 3 mm) were cut on thirty extracted third molars, which were randomly allocated to three experimental groups. All the buccal cavities were pretreated with polyacrylic acid, whereas the lingual cavities were treated with thre...

This study compared the shear bond strength (SBS) to enamel of five self-etching primer/adhesive systems and one total-etch, one-bottle adhesive system. Sixty freshly extracted bovine incisors were mounted, polished to 600-grit and randomly assigned to six groups (n=10): Adper Prompt Self-Etch (AD), OptiBond Solo Plus Self-Etch (OP), AdheSE (AS), Tyrian (TY) and Clearfil SE Bond (SE) as self-et...

Multi-mode universal adhesives (UA) are indicated as either self-etch or etch-and-rinse adhesives, and manufacturers also recommend an alternative ‘selective enamel etch’ technique. Currently available laboratory data support phosphoric acid selective etching of enamel prior to use of UA to improve bond strength. In another way to improve adhesion to enamel of UA without the use of phosphoric a...

Above wafer topography of the substrate, such as wafer clamps, is known to impact adjacent feature profiles during plasma etching of microelectronic devices. The consequences of subwafer topography, such as electrostatic chucks and cooling channels, on feature profiles is less well characterized. To investigate these issues we have developed and integrated a plasma equipment model and a Monte C...

The oxidation of highly oriented pyrolytic graphite (HOPG) in air at elevated temperatures was studied by examination of the oxidized HOPG by scanning tunneling microscopy (STM). Etch pits of uniform size and monolayer depth were readily formed on preexisting defects or generated vacancies in the HOPG basal plane by heating freshly cleaved HOPG samples in air at 650 OC. The density of the pits ...

BACKGROUND A prolonged life of fissure sealant has always been the target for preventing caries in vulnerable newly erupted teeth. The use of preparatory techniques including bur introduction to the fissures is considered among such improving steps. MATERIALS AND METHODS Ninety freshly extracted healthy maxillary premolar teeth were randomly selected for this investigation. Teeth were then di...

Reactive ion etching of aluminum (Al) had been carried out with BCl3/Cl2, and process optimization was performed using statistical process modeling technique. I-optimal design was employed to set up the etch experiment with operating parameters, namely, gas composition, RF power, and chamber pressure. Analysis has been performed on etch rate, selectivity, and profile, individually, and the proc...