Numerical predictive accuracy is investigated for transient component heat transfer using a Computational Fluid Dynamics (CFD) code dedicated to the thermal analysis of electronic equipment. The test cases are based on a single Printed Circuit Board (PCB)-mounted, 160-lead PQFP component, analyzed in still-air, and both 1 and 2.25 m/s forced airflows. Three types of transient operating conditio...

A rice starch based film, reinforced with starch nanocrystals (prepared by submitting native granules of rice starch to acid hydrolysis at 40 oC) was prepared by casting film-solution on leveled trays. The influence of the content of starch nanocrystals (5 to 30%) on the mechanical, thermal and structural properties of rice starch films was investigated. The rice starch films showed an increase...

This data article contains the dynamic mechanical thermal analysis (DMTA) results for sheets made from cellulose fibers partially converted to dialcohol cellulose as presented in "Advanced Three-Dimensional Paper Structures: Mechanical Characterization and Forming of Sheets Made from Modified Cellulose Fibers" by Linvill et al. [1]. See Larsson and Wågberg [2] for a description and characteriza...

this paper deals with the dynamic analysis of stress field in cylindrically layeredstructures reinforced by carbon nanotube (clsrcn) subjected to mechanical shock loading.application of meshless local integral equations based on meshless local petrov-galerkin(mlpg) method is developed for dynamic stress analysis in this article. analysis is carriedout in frequency domain by applying the laplace...

Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and ...

A thermal bridge is a part of the building envelope where the otherwise uniform thermal resistance is significantly changed by: • Full or partial penetration of the building envelope by materials with a different thermal conductivity and/or • A change in thickness of the structure and/or • A difference between internal and external areas, such as occur at wall-floor-ceiling junctions. INTRODUCT...

Composite acrylonitrile-butadiene-styrene (ABS)/carbon nanotubes (CNT) filaments at 1, 2, 4, 6 and 8 wt %, suitable for fused deposition modelling (FDM) were obtained by using a completely solvent-free process based on direct melt compounding and extrusion. The optimal CNT content in the filaments for FDM was found to be 6 wt %; for this composite, a detailed investigation of the thermal, mecha...

Fracture analysis of glass/epoxy composites under different thermal cycling conditions is considered. Temperature difference, stacking sequence, fiber volume fraction and number of thermal cycles are selected as the experimental design factors. The Taguchi method is implemented to design of the experiment and an apparatus is developed for automatic thermal cycling tests. The tensile tests are d...

the dissipated energy from periodic deformation is regarded as the main reason for heat generation and temperature rise inside the tire domain. however, the mechanical behavior of rubber parts is highly temperature dependent. in most performed investigations, the influence of thermal effects on stress/ deformation fields of pneumatic tires is ignored and just temperature distribution is conside...

Low cost composite materials are widely used in civil and structural engineering applications. This project uses EPON to plasticize a commonly used resin, epoxy resin to lower the cost of the composite and to find out the mechanical and thermal properties of the plasticized epoxy resin to see if it is suitable for the said applications. Three point bending tests were carried out to evaluate the...