نتایج جستجو برای: bi strain
تعداد نتایج: 263858 فیلتر نتایج به سال:
OBJECTIVE Scavenger receptor class B type I (SR-BI)/apolipoprotein E (apoE) double knockout (dKO) mice exhibit many features of human coronary heart disease (CHD), including occlusive coronary atherosclerosis, cardiac hypertrophy, myocardial infarctions, and premature death. Here we determined the influence of B and T lymphocytes, which can contribute to atherosclerosis, ischemia-reperfusion in...
The grain-boundary dislocation arrangement and decomposition during constant-volume deformation of a nanoscale bi-crystal system in fcc-structured materials were studied by using the two-mode phase-field crystal (2PFC) method. effects different grain boundary misorientations (GBMs) tensile directions on are analyzed. In three symmetrical tilt boundaries evaluated PFC, atomic density profile cha...
BACKGROUND Recently, a hepatitis C virus (HCV) cell-culture system was developed that employed strain JFH1 (genotype 2a), and JFH1-based intra- and intergenotypic recombinants now permit functional studies of the structural genes (Core, E1, and E2), p7, and NS2 of genotypes 1-4. The goal was to adapt the system to employ genotype 5. METHODS Huh7.5 cells infected with SA13/JFH1, containing Cor...
تعمیمی از برد عددی
The incorporation of dilute concentrations bismuth into traditional III–V alloys produces significant reductions in bandgap energy presenting unique opportunities strain and engineering. However, the disparity between ideal growth conditions for host matrix those required substitutional has caused material quality these III–V–Bi to lag behind that conventional semiconductors. InSb1−xBix, while ...
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite elemen...
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