Large-scale photonic integration circuits (PICs) have been demonstrated on InP [1] and Si [2–5] substrates for data communications. Silicon PICs 3D integrated with electronic integrated circuits promise future high-speed and cost-effective optical interconnects to enable Exascale performance computers and datacenters [5]. For realistic intra-chip and inter-chip optical links, the bandwidth dens...

Cloud computing and web emerging application has created the need for more powerful data centers with high performance interconnection networks. Current data center networks, based on electronic packet switches, will not be able to satisfy the required communication bandwidth of emerging applications without consuming excessive power. Optical interconnects have gained attention recently as a pr...

— Optical packet switching is a promising technology, which can integrate both data and optical network. In this paper, we present a comparative study of various traffic arrival approaches in WDM packet switches. The comparison is made based on packet loss rate and average delay under uniform and self-similar Pareto traffic. Computer simulations are performed in order to obtain the switch perfo...

Recently, silicon-integrated optical circuits have attracted intensive interests, thanks to the compatibility with complementary metal-oxide-semiconductor (CMOS) technology that enables mass production at low cost. The switch is an essential part of integrated circuits, broad applications in communications and networks, computing, sensing such as LiDAR. In general, adopts thermo-optic or carrie...

The impact of ultra-fast carrier dynamics in semiconductor optical amplifiers (SOAs) on switches based on cross-gain and cross-phase modulation is analyzed theoretically and experimentally. We find that ultra-fast effects lead to additional spectral broadening, which improves the optical signal-to-noise ratio for switches based on an SOA and an optical filter. For such switches, the influence o...