OBJECTIVE To evaluate, using conventional in vitro procedures, the abrasivity, enamel polishing properties, and stain removal effectiveness of various commercial dentifrices that have a variety of compositions and are marketed for cleaning, whitening, and/or polishing capabilities, and to examine their relationships between stain removal and abrasivity. METHODS The Relative Dentin Abrasivity ...

The objective of the current research is to model and control the wiresaw manufacturing processes in wafer slicing. Other than a few patents in industrial management of wiresaw, the wiresaw manufacturing process has remain poorly investigates. The purpose of this research is to investigate and understand the fundamental mechanism of this critical technology in slicing silicon wafers and ceramic...

This paper describes an ultra precision polishing method of aspherical mirrors, and the fundamental research on polishing characteristics. The aspherical mirrors with a diameter of about 30mm made by fused silica glass and CVD-SiC were ELID (electrolytic in-process dressing)-ground to high form accuracy with #4000 cast iron bonded diamond wheel, and then polished with a small polishing tool. As...

Introduction: Air-powder polishing devices are increasingly used for stain and plaque removal. However, besides cleaning the tooth surface, they may increase the surface roughness of the dental tissues. This in turn may result in plaque accumulation and superficial degradation. Thus the aim of this study was to assess the influence of three different abrasive agents: Pumice, Sodium bicarbonate ...

Applied pressure in chemical mechanical polishing CMP is shared by the two-body pad–wafer and the three-body pad–abrasive– wafer contacts. The fraction of applied pressure transferred through the particle contacts is a significant factor as most of the material removal is due to abrasive particles trapped in the pad–wafer interface. In this work, the contact of a rough, deformable pad and a smo...