Chip multiprocessing (CMP) and simultaneous multithreading (SMT) are two recently adopted techniques for improving the throughput of general-purpose processors by using multithreading. These techniques are likely to benefit the increasingly important real-time multimedia workloads, which are inherently multithreaded. These workloads, however, often run in an energy constrained environment. This...

Silica sol nano-abrasives with large particle are prepared and characterized by TEM, PCS and Zeta potential in this paper. Results show that the silica sol nano-abrasives about 100nm are of higher stability (Zeta potential: -65mV) and narrow distribution of particle size. And then alkali CMP slurries for tungsten containing self-made silica sol nanoabrasives are prepared and applied. CMP result...

The increased dependence of clock cycle time on interconnect delay favors chip multiprocessors (CMP) as the basis for future microprocessor designs. The tight coupling of processing units in a CMP allows new forms of parallelism to be exploited. This paper studies multiple-path execution (MPE) on a CMP design to provide speedup on unmodified sequential code by exploring different paths of a con...

Cardiomyoplasty (CMP) is a surgical therapy for dilated cardiomyopathy. In this procedure the "latissimus dorsi" is wrapped around the heart and chronically paced synchronously with ventricular systole. CMP has been performed in more than 500 cases worldwide, 42 cases in Italy, with variable degrees of success. Despite symptomatic improvement in the majority of patients surviving the procedure,...

In this paper, a neural network based uniformity controller is developed for the linear chemical–mechanical planarization (CMP) process. The control law utilizes the metrology measurements of the wafer uniformity profile and tunes the pressures of different air-bearing zones on Lam linear CMP polishers. A feedforward neural network is used to self-learn the CMP process model and a direct invers...

This work briefly presents the basic theory, the development, and a primary demonstration of a devicelevel chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston’s equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effec...

Most modern Chip Multiprocessors (CMP) feature shared cache on chip, whose influence on the performance of multithreaded programs, unfortunately, remains unclear due to the limited coverage of the deciding factors in prior studies. In this work, we conduct a systematic measurement of the influence using a recently released CMP benchmark suite, PARSEC, with a spectrum of factors considered. The ...

Chemical Mechanical Polishing (CMP) is currently being used in the fabrication of state-of-the-art integrated circuits, and has been identified as an enabling technology for the semiconductor industry in its drive toward gigabit chips and sub-130nm feature sizes. In this project we present the application of a library-based specular spectroscopic scatterometry method, which is capable of gettin...