Angiopoietin-1 (Ang1), a potential growth factor for therapeutic angiogenesis and vascular stabilization, is known to specifically cluster and activate Tie2 in high oligomeric forms, which is a unique and essential process in this ligand-receptor interaction. However, highly oligomeric native Ang1 and Ang1 variants are difficult to produce, purify, and store in a stable and active form. To over...

This paper reports a novel fabrication process to develop planarized isolated islands of benzocyclobutene (BCB) polymer embedded in a silicon substrate. Embedded BCB in silicon (EBiS) can be used as an alternative to silicon dioxide in fabrication of electrostatic micromotors, microgenerators, and other microelectromechanical devices. EBiS takes advantage of the low dielectric constant and ther...

Simultaneous multithreading (SMT) and chip multiprocessing (CMP) both allow a chip to achieve greater throughput, but their thermal properties are still poorly understood. This paper uses Turandot, PowerTimer, and HotSpot to evaluate the thermal efficiency for a Power4/Power5-like core. Our results show that although SMT and CMP exhibit similar peak operating temperatures, the mechanism by whic...

Human UMP/CMP kinase (EC 2.7.4.14) is responsible for phosphorylation of CMP, UMP, and dCMP and also plays an important role in the activation of pyrimidine analogs, some of which are clinically useful anticancer or antiviral drugs. Previous kinetic data using recombinant or highly purified human UMP/CMP kinase showed that dCMP, as well as pyrimidine analog monophosphates, were much poorer subs...

INTRODUCTION Interactions of the ceria particles with polyurethane surfaces are of great interest for polishing processes used in modern semiconductor industry. Specifically, ceria abrasive nanoparticles and polyurethane polishing pads are now broadly used in the process called Chemical-Mechanical Planarization/Polishing (CMP) [1,2,3]. To optimize the process of CMP, various chemicals, abrasive...

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in both front-end (STI) and back-end (ILD) integrated circuit manufacturing. Conventional CMP processes utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. More recent work has examined the use of a fixed abrasive CMP pad [1], in which abrasive material is embedded...

BACKGROUND Sperm coating protein beta-defensin 126 (DEFB126) is adsorbed onto the entire surface of macaque sperm in the caudal epididymis and is retained on viable sperm collected from the cervix and the uterine lumen of mated female macaques. We investigated the role of sperm coating protein DEFB126 in cervical mucus penetration (CMP). METHODS Cervical mucus (CM) was collected from peri-ovu...

BACKGROUND Theories, models, and frameworks used by implementation science, including Diffusion of Innovations, tend to focus on the adoption of one innovation, when often organizations may be facing multiple simultaneous adoption decisions. For instance, despite evidence that care management practices (CMPs) are helpful in managing chronic illness, there is still uneven adoption by physician o...