Ti3SiC2 ceramic and copper were successfully vacuum brazed using Ag-Cu-Ti filler with mesh, respectively. In this study, the effects of mesh brazing parameters on interface microstructure mechanical properties joints systematically studied. The results revealed that typical interfacial joint was ceramic/Ti5Si3 + TiC Ti2Cu Ti3Cu/Ag (s, s) Cu s)/eutectic Ag-Cu TiSiCu/Cu. A maximum shear strength ...

Highly oriented NiFe thin films have been produced via sputter deposition on HF etched Si substrates. Cu and Ag are used as underlayers to induce the epitaxial growth of NiFe films. The orientation relationships between NiFe, Cu, Ag, and Si have been determined by x-ray diffraction measurements and transmission electron microscopy. Magnetic properties have also been characterized. © 1999 Americ...

Age-hardening characteristics in a dental low-gold alloy composed of 40.0 wt% Au-35.0 wt% Ag-7.9 wt% Pd-7.0 wt% Cu-5.0 wt% In-3.5 wt% Zn-1.5 wt% Sn, were investigated by means of the hardness test, XRD study, SEM observations and EPMA. The following results were obtained. The age-hardening was characterized by a precipitation of Cu-rich alpha2 phase in the a phase. The softening that occurred f...

taknar polymetal (cu-zn-au-ag-pb) deposit: a new type magnetite-rich vms deposit, northeast of iran

Diffusion and decay of alloyed Cu/Ag islands are investigated in the size range from 1 to 40  nm2 on Ag(100) at room temperature with fast-scanning tunneling microscopy and density functional theory. While islands at sizes above 7  nm2 show the diffusion and decay behavior expected for dynamics based on single atom hopping, islands smaller than 4  nm2 diffuse faster and decay slower than predic...

Combining first-principles calculations and in situ photoelectron spectroscopy, we show how the composition and structure of the surface of an alloy catalyst is affected by the temperature and pressure of the reagents. The Ag-Cu alloy, recently proposed as an improved catalyst for ethylene epoxidation, forms a thin Cu-O surface oxide, while a Ag-Cu surface alloy is found not to be stable. Sever...

A new silver nanoparticle modified screen-printed electrode was developed and applied to the simultaneous determination of Pb(II) and Cu(II). Two different types of silver nanoparticles with different shapes and sizes, Ag nanoseeds and Ag nanoprisms, were microscopically characterized and three different carbon substrates, graphite, graphene and carbon nanofibers, were tested. The best analytic...

We have investigated the role played by atomic structure and reactivity of supporting Ag(111) Cu(111) surfaces on formation 2D metal–organic networks (2D-MONs) involving metal adatom clusters spawned these two surfaces. While hexahydroxytriphenylene (HHTP) molecule forms complexes with Ag3 Cu3 on, respectively, surfaces, an extended order is only observed in 2D-MON Ag(111). By combining scannin...

Abstract Copper (Cu) wire has been extensively used in the semiconductors industry to replace gold because of its cost-effectiveness and high performance. However, it a massive challenge oxidation rate, hardness, susceptibility corrosion which is time-sensitive under environmental conditions. One attractive factors investigate electrolytes assembly process copper wire. these electrolyte chemica...