نتایج جستجو برای: tsv
تعداد نتایج: 599 فیلتر نتایج به سال:
In this paper we have proposed a test cost model for core-based 3D Stacked ICs (SICs) connected by Through Silicon Vias (TSVs). Unlike in the case of non-stacked chips, where the test flow is well defined by applying the same test schedule both at wafer sort and at package test, the most cost-efficient test flow for 3D TSV-SICs is yet undefined. Therefore, analysing the various alternatives of ...
Several recent works have demonstrated the benefits of through-silicon-via (TSV) based 3D integration [1-4], but none of them involves a fully functioning multicore processor and memory stacking. 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) is a two-tier 3D IC, where the logic die consists of 64 general-purpose processor cores running at 277MHz, and the memory die contains 256K...
This paper highlights a number of challenges and solutions developed to meet the needs of MEMS manufacturers using 3D packaging for low I/O count devices. Various process steps, such as, TSV etch, dielectric liner deposition, barrier/seed PVD have been developed and optimized to increase electrical performance, increase throughput and reduce costs for volume production. In particular, various s...
AIM To evaluate the usefulness of the newly designed 25-gauge (25-G) microcannula for transconjunctival sutureless vitrectomy (TSV). METHODS 25-G TSV was performed on 20 consecutive eyes with the newly designed 25-G microcannulas. We studied usefulness, intraoperative and postoperative complications in these cases. RESULTS No complications were recognized during surgery. Postoperative compl...
This paper is the first to report a large-scale directcurrent electrodeposition of columnar nanotwinned copper within through silicon via (TSV) with a high aspect ratio (~4). With this newly developed technique, void-free nanotwinned copper array could be fabricated in low current density (30 mA/cm²) and convection conditions (300 rpm), which are the preconditions for copper deposition with a u...
The three dimensional circuit (3D-IC) brings forth new challenges to physical design such as allocation and management of through-silicon-vias (TSVs). Meanwhile, the thermal issues in 3D-IC becomes significant necessitating the use of active cooling schemes such as micro-channel liquid coolings. Both TSVs and micro-channels go through the interlayer regions of 3D-IC resulting in potential resou...
In current Semantic Web community, some researches have been done on ranking ontologies, while very little is paid to ranking vocabularies within ontology. However, finding important vocabularies within a given ontology will bring benefits to ontology indexing, ontology understanding and even ranking vocabularies from a global view. In this paper, Vocabulary Dependency Graph (VDG) is proposed t...
We present the 3D Trajectory-based Stress Visualizer (3D-TSV), a visual analysis tool for exploration of principal stress directions in solids under load. 3D-TSV provides modular and generic implementation key algorithms required trajectory-based directions, including automatic seeding space-filling lines, their extraction using numerical schemes, mapping to an effective renderable representati...
We have studied the stress evolution in the tungsten film of a particular open TSV technology during the thermal processing cycle. The film is attached to the via’s wall, where scallops were observed as a result of the Bosch processing. Our work describes a scheme which considers the scallops on the TSV and conjugates a stress model for thin-films with the traditional mechanical FEM approach. T...
In order to analyze the thermal environment and its influence on workers’ adaptation, a field study was conducted in rubber factory during winter. Indoor outdoor environmental parameters were measured subjective questionnaire surveys collected. The from November January next year. During survey, indoor temperature range of 12.6 21.7°C air velocity ranged 0.15 0.3 m/s. clothing insulation heatin...
نمودار تعداد نتایج جستجو در هر سال
با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید