Light field display systems present visual scenes using a set of directional light beams emitted from multiple light sources as if they are emitted from points in a physical scene. These displays offer better angular resolution and therefore provide more depth of field than other automultiscopic displays. However in some cases the size of a scene may still exceed the available depth range of a ...

Plasma atomic layer etching is a dry process using dose step to modify material’s surface chemistry and an etch remove the modified layer. This method of has certain advantages over reactive ion due its self-limiting for highly controllable depth reduced roughness. In this paper, we expand upon anisotropic, plasma recipe used thin films silicon nitride, which uses H2 material SF6 surface. Sever...

We report on a process to form micron-scale inverse cones in crystalline silicon without any masking steps using selective, low temperature (<175°C) plasma process. The selectivity of the originates from use H 2 that preferentially etches away amorphous cones, formed as result epitaxial breakdown, leaving surrounding material behind. Efficient etching is realized by pre-coating reactor walls wi...

Cold atmospheric pressure plasma jets (APPJs) are able to generate chemically reactive species desired for material processing and biomedical applications. A great amount of attention has been devoted to characterizing these APPJ sources and expanding their applications. Less is known on the interaction mechanisms between cold atmospheric pressure plasma and material surfaces. Since both plasma...

The paper presents a study of the formation holographic diffraction gratings in thin films chalcogenide glassy semiconductors. recording process at argon-laser radiation wave length 488 nm and chemical etching that enables а relief grating are analysed. optimum conditions for arsenic sulfide As2S3 defined. It is shown an argon laser exposure comes to ∼5–8 J/cm2. At stage quasi-phase (relief-pha...

Background and aims. Er:YAG laser irradiation has been claimed to improve the adhesive properties of dentin; therefore, it has been proposed as an alternative to acid etching. The aim of this in vitro study was to investigate the shear bond strength of an etch-and-rinse adhesive system to dentin surfaces following Er:YAG laser and/or phosphoric acid etching. Materials and methods. The roots of ...

Positron annihilation spectroscopy and complementary methods were used to detect changes induced by sandblasting of alumina particles at different pressures varying from 1 to 6 bar in pure well-annealed copper. The positron lifetime measurements revealed existence of dislocations and vacancy clusters in the adjoined surface layer. The presence of retained alumina particles in the copper at the ...

In this paper a method is proposed to fabricate channels for fluidic applications with a depth in the nanometer range. Channels with smooth and straight sidewalls are constructed with the help of micromachining technology by etching shallow trenches into 〈110〉 silicon using native oxide as a mask material and OPD resist developer as the etchant. Sub-50 nm deep fluidic channels are formed after ...

In many applications such as optoelectronic devices, three-dimensional (3D) structures are required. Examples include photonic band gap (PBG) crystals, diffractive optical elements, blazed gratings, MEMS, NEMS, etc. It is known that the performance characteristics of such structures are highly sensitive to their dimensional fidelity. Therefore, it is essential to have a fabrication process by w...