Keywords: Shear strength Microstructure Single-shear lap joint Intermetallic compound (IMC) Aging a b s t r a c t The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10 days at 120 °C and 170 °C, respectively, and then loaded to failure in shear with a cons...

early a million years ago, mankind’s technological march through time beN gan after fire was mastered. Metalworking, which evolved into metallurgy, is the oldest and most successful technology. It spans at least 12,000 years (Figure 1). Soldering, a key metal joining technology, was probably developed about 7,000 years ago when lower melting, naturally occurring metal alloys were placed in the ...

0026-2714/$ see front matter 2012 Elsevier Ltd. A doi:10.1016/j.microrel.2012.02.018 ⇑ Corresponding author. Tel.: +61 7 3365 1387; fax E-mail address: [email protected] (G. Zeng). The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research...

Abstract Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is change roughness mask influence flux spreading around pad. second deposition same volume paste pads a modified, thicker stencil smaller apertu...

An investigation on the solder bumped Flip Chip on Printed Circuit Board (FCOB) is presented in this paper. The emphasis is placed on the effects of delamination crack between the underfill encapsulant and the solder mask on the solder joint reliability of FCOB. In the present study, a fracture mechanics approach is employed. The strain energy release rate at the crack tip between the underfill...

In this paper, we described an approach ,to automation of visual inspection of solder joint defects of SMC(suface mounted components) on PCBs (Printed Circuit Board) by using neural network and fizzy rule-based classification method. Inherent&, suface of the solder joints is curved, tiny and specular reflective; it induces a difiiccul~ of taking good image of the solder joints. And the shape of...

In this paper, the Moir e interferometry technique is used to measure the in situ displacement evolution of lead-free solder joint under electric current stressing. Large amounts of deformation were observed in the solder joint under high density (above 5000 A/cm) current stressing. The deformation was found to be due to electromigration in the solder joint and an electromigration constitutive ...

Incorporation of metallic particulate reinforcements in eutectic Sn-Ag solder re­ sults in the formation of intermetallic compounds (IMCs) along particulate/ solder interfaces with different morphologies. For instance, “sunflower” and “blocky faceted” IMC shapes have been observed around Ni particle reinforce­ ments incorporated in the eutectic Sn-Ag solder matrix. The time and tempera­ ture ab...

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...