Due to the brittleness of silicon, use a diamond wire cut silicon wafers is critical stage in solar cell manufacturing. In order improve production yield cutting process, it necessary have thorough understanding phenomena relating parameters. This research reviews and summarizes technology for precision machining monocrystalline using sawing (DWS). Firstly, mathematical models, molecular dynami...

Monocrystalline silicon slicing is the first step in making chips, and surface quality of wafers directly affects later processing accounts for a large proportion chip manufacturing cost. Ultrasonic vibration assisted wire saw (UAWS) an effective sawing process cutting hard brittle materials such as monocrystalline Si, which can significantly improve wafers. In order to further study formation ...

Abstract As a starting point in equipment manufacturing, sawing plays an important role industrial production. Intelligent manufacturing is carrier of intelligent technologies. Due to the backwardness technology, comprehensive performance equipments China obviously different from that foreign countries. State art advanced investigated along with technical bottleneck machine tool and new scheme ...

Epitaxially-grown wafers on top of sintered porous silicon are a material-efficient wafer production process, that is now being launched into mass production. This process makes the material-expensive sawing procedure obsolete since can be easily detached from its seed substrate. With high-throughput inline processes, fast and reliable evaluation processes crucial. The quality layers plays an i...

A human skeleton was found in a forest after an aging time (laydays) of nearly three years. Surprisingly a larger number of living maggots crawled out of the medullary cavity of the humerus after sawing it longitudinally. Investigations of other long bones showed remnants of maggots, fly-pupas and maggot-excrements in similar cases. A humerus is found after an estimated aging time of over 100 y...

A new method for creating microcantilevers in glass allows integration of optical waveguides and Bragg gratings. Devices are fabricated by high precision sawing, followed by direct UV writing of waveguides with Bragg gratings and then chemical etching to release the freestanding glass structures. Optical measurement of the Bragg gratings together with piezo-actuation allows the mechanical reson...

A class of poly(ethylene-co-methacrylic acid) (EMAA) copolymers and ionomers has shown the unique ability to instantaneously self-heal following ballistic puncture. It is noteworthy that the thermomechanical healing process active in these materials appears to be significantly different in capability and mechanism than any of the other self-repairing systems studied. To better understand this p...

Novel Backend Singulation Techniques to Enable Commercialization of Optical MEMS Jim Aberson 1 , Pierre Cusin 1 , James Wylde 2 , Ryan Hickey 2 , Heiko Fettig 2 MEMS chips that are to be implemented into higher-level functional modules are typically composed of exposed structures that may be vulnerable to conventional wafer and die handling. Thus, successful commercialization of such components...