Abstract A Au/Ta/Ti metal multilayer was developed to improve the high vacuum packaging process for microdevice fabrication. This study revealed that wafer coated with layer could form direct bonding and absorb residual gas. We investigated effect of Ta thickness on diffusion Ti atoms. The multilayers were successfully bonded after a degassing when barrier is thicker than 1.5 nm. Moreover, film...

Recently, active research is being conducted on polymer solar cells to improve power conversion efficiency by developing new device structures, synthesizing materials, and applying them charge extraction layers. In this study, we analyzed the influence of ZnO performance using various thin films (using high low temperature sol-gel processes nanoparticle process) as an electron layer in inverted...

The study deals with the handling of thin wafers in 3D integration. It concerns fabrication 300 mm industrial tools. Usually, manufacturing is based on a temporary bonding process performed at 200 °C using thermoplastic adhesive. In that condition bonding, thinning and dismounting are satisfactory. Moreover, adhesive flattening during results an excellent thickness uniformity bonded pairs, smal...