Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of gr...

The mechanochemical preparation of highly functionalized 3,5-disubstituted hydantoins was investigated in the presence of various poly(ethylene) glycols (PEGs), as safe grinding assisting agents (liquid-assisted grinding, LAG). A comparative study under dry-grinding conditions was also performed. The results showed that the cyclization reaction was influenced by the amount of the PEG grinding a...

This paper describes an ultra precision polishing method of aspherical mirrors, and the fundamental research on polishing characteristics. The aspherical mirrors with a diameter of about 30mm made by fused silica glass and CVD-SiC were ELID (electrolytic in-process dressing)-ground to high form accuracy with #4000 cast iron bonded diamond wheel, and then polished with a small polishing tool. As...

Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

A on-line monitoring new method for grinding quality is presented based on theory analysis and test study, which collects the information of grinding quality from the AE signals produced by friction and grinding process to realize the on-line intelligent detection and prediction of grinding quality by A wavelet neural network & Fuzzy BP algorithm based network. The reliability and feasibility o...

It is always attempted to reduce the costs of comminution in mineral processing plants. One of thedifficulties in size reduction section is not to be designed properly. The key factor to design size reductionunits such as crushers and grinding mills, is ore’s work index. The work index, wi, presents the oregrindability, and is used in Bond formula to calculate the required energy. Bond has defi...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

In order to investigate the breakage behavior of feed in industrial secondary ball mills, characteristics fine magnetite were analyzed. Magnetite particle produces a bimodal size distribution that is consistent with typical abrasion. The mill can increase surface area by reducing diameter steel balls enhance Industrial application results show after abrasion for grinding was enhanced, circulati...