We have measured the extreme-ultraviolet (EUV) efficiency at an angle of incidence of 10 degrees of a flat crystalline anisotropically etched blazed grating. The measured efficiencies are high for uncoated gratings and agree well with a calculated model derived from a reasonable estimate of the groove profile. The highest groove efficiencies derived from the measurements are 48.8% at 19.07 nm a...

We have observed nanoscale phase separation in amorphous arsenic trisulfide As2S3 films produced by ultrafast pulsed laser deposition and its effect on the surface morphology of the film after plasma etching. When the film was etched in CF4–O2 plasma, a grainy structure was observed on the surface. From Raman and x-ray photoelectron spectroscopies, we concluded that the grainy structure of the ...

Index-matched indium tin oxide (ITO) electrodes for capacitive touch screen panels have been fabricated to improve optical transmittance and reduce the difference of reflectance (deltaR) between the etched and un-etched regions. 8.5 nm Nb2O5 and 49 nm SiO2 thin films were deposited by magnetron sputtering as index-matching layers between an ITO electrode and a glass substrate. In case of 30 nm ...

INTRODUCTION High precision pressure sensors based on resonating techniques have been manufactured for many years but use large transducer components and often have unwieldy media isolation techniques. This paper presents a MEMS Resonant Pressure Transducer (RPT) that is produced using a flexible fabrication route to allow pressure ranges from 1bar to 700bar in fully oil isolated hermetic packa...

The freeze-etching technique, which is a special kind of freeze-drying, allows electron microscopic investigation of cells and tissues in the frozen state. In regard to yeast cells (Saccharomyces cerevisiae) a freeze-fixation technique has been developed which does not kill the object. The electron micrographs therefore are considered to impart an image of high fidelity. The cutting of the froz...

 Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is presented. Successful thinning of wafers by lapping and polishing until the cavities previously etched by deep reactive ion etching are reached is demonstrated. The possible causes of damage to the etched structures are investigated. The trapping of particles in the cavities is studied a...

Plasma etching of lithium niobate with fluorine gases is limited by the redeposition LiF. This results in a low etch rate and nonvertically etched walls. Etching of proton-exchanged lithium niobate can prevent the LiF deposition to a large extent because of the greatly reduced lithium concentration in lithium niobate. We performed different inductively coupled plasma etching processes using SF6...

An oxide aperture is used to confine optical modes in a micropillar structure. This method overcomes the limitations due to sidewall scattering loss typical in semiconductor etched micropillars. High cavity quality factors (Q) up to 48 000 are determined by external Fabry-Perot cavity scanning measurements, a significantly higher value than prior work in III-V etched micropillars. Measured Q va...

Identification of chloroplast coupling factor particles, by the freeze-etching and negative-staining techniques, was made utilizing chloroplast thylakoids isolated from spinach leaves. Complete removal of particles, comparable in diameter to purified coupling factor particles, from the outer surface of freeze-etched thylakoids was achieved by treatment with 0.8% silicotungstate. Reappearance of...

The structural and morphological characteristics of visible-light-emitting porous Si layers produced by anodic and stain etching of single-crystal Si substrates are compared using transmission electron microscopy and atomic force microscopy ( AFM) . AFM of conventionally anodized, laterally anodized and stain-etched Si layers show that the layers have a fractal-type surface morphology. The anod...