This study evaluated the effect of multiple consecutive adhesive resin coatings of adhesive bonded to human dentin on nanoleakage and resin-dentin bond strength. Resin bonded dentin specimens were prepared using a total-etch adhesive (One-Step Plus) applied as multiple consecutive coating, or using two self-etch adhesive systems (iBond or Fluoro Bond). For the total-etch adhesive, resin applica...

AIM This study aims to evaluate the bonding effectiveness of self-etch and etch-and-rinse adhesive systems in on intact and ground primary tooth enamel. STUDY DESIGN Sixty primary incisors were divided into 6 groups according to the adhesive system (etch-and-rinse - Adper Single Bond 2 - SB, 2 steps self-etch -Clearfil SE Bond - SE, and 1 step self-etch - One Up Bond F Plus OBF) and to the su...

OBJECTIVES This study examined concurrent validity of the Evaluation Tool of Children's Handwriting-Cursive (ETCH-C) by comparing ETCH-C total legibility percentage scores with handwriting grades from teachers. The study also identified the legibility percentage score discriminating between satisfactory and unsatisfactory handwriting. METHOD The participants were 101 fourth graders who comple...

A low cost nanosphere lithography method for patterning and generation of semiconductor nanostructures provides a potential alternative to the conventional top-down fabrication techniques. Forests of silicon pillars of sub-500 nm diameter and with an aspect ratio up to 10 were fabricated using a combination of the nanosphere lithography and deep reactive ion etching techniques. The nanosphere e...

The aim of this study was to compare the microleakage of total-etch and self-etch adhesives by three methods including dye extraction, dye penetration and fluid filtration with determining the correlation value among these techniques. Seventy-two premolar teeth were selected for this in vitro study and Class 5 cavities were prepared on the buccal surface of these at the cemento-enamel junction ...

The influence of reactor wall conditions on the characteristics of high density fluorocarbon plasma etch processes has been studied. Results obtained during the etching of oxide, nitride, and silicon in an inductively coupled plasma source fed with various feedgases, such as CHF3 , C3F6 , and C3F6/H2 , indicate that the reactor wall temperature is an important parameter in the etch process. Ade...

We present analytical and computational models used to investigate the dependence of etch resolution on pulse duration, tool radius, and etched feature aspect ratio in electrochemical machining with ultrashort voltage pulses. Our results predict that, for the high aspect ratio system in which the effect of trench top and bottom edges can be ignored, the increase of etch resolution with pulse le...

Plasma etch is a complex semiconductor manufacturing process in which material is removed from the surface of a silicon wafer using a gas in plasma form. As the process etch rate cannot be measured easily during or after processing, virtual metrology is employed to predict the etch rate instantly using ancillary process variables. Virtual metrology is the prediction of metrology variables using...