*The views expressed here are those of the author and do not necessarily represent the views of the Federal Reserve bank of Philadelphia or the Federal Reserve System. 1 The economic Recovery Act of 2008, which was enacted on July 30, 2008, established the Federal housing Finance Agency (FhFA) by combining the Office of Federal housing enterprise Oversight (OFheO) and the Federal housing Financ...

The board of an insurance company is the supreme governing body company. It has numerous stakeholders and many duties, which are discussed in this paper. literature review concerns e.g., non￾executive directors, risk taking oversight, ESG diversity policies. In discussion relation to duties obligations described. include owners company, CEO FSA outsourcing partners. Other covered topics key fun...

gypsum-bonded particleboard panels were made from various mixture of bagasse (saccharum ossicinarum l.) and wheat (oryza sativa l.) straw particles bonded with different ratio level of particles/gypsum. this study examined possible feasibility of bagasse and wheat straw particles in the production of gypsum-bonded particleboard (gbpb). one-layer experimental gbpb with density of 1.05 and 1.20 g...

This paper describes the integration of printed circuit board design and fabrication into a computer architecture course. These printed circuit boards utilized 7400-series chips to realize an 8-bit ALU having the functions ADD, OR, ADD, SUB, and set-less-than. Students designed and laid out the boards using electronic tools. Their designs were sent out for fabrication and the resulting boards w...

Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between power and ground planes. New materials have recently been developed by competing companies that promise to reduce the cost and improve the performance of boards with embedded capacitance. This paper introduces simple models for embedded capacitance boards and exa...

A new model for dielectric loss, suitable for time domain modeling of printed circuit boards, is proposed. The model is based on a physical relaxation model. Complete time domain modeling of skin effect and dielectric losses in FR-4 boards are demonstrated and experimentally verified. Finally, the developed model is used to predict that FR-4 boards are useful for data rates up to 10 Gb/s.