Background: Heavy metals in aquatic systems usually interfere with many beneficial uses of water. Divalent nickel is a commonly occurring toxic metal in natural ecosystems due to the effluent of refineries, electroplating, and casting industries. In aquatic environments, nickel appears as Ni (II) and Ni0. Despite the high reported toxicity for Ni (II), Ni0 is only slightly toxic. Various meth...

Believe that VSM involves the concurrent improve of processes, organizations, and their supporting information systems to achieve radical improvement in time, cost, quality, and customer’s regard for the company’s products and services.  Nowadays, simulation is the most important way to do VSM and improving logistics processes. A time study was performed by measuring the time duration per proce...

Based on survey data for Switzerland, new empirical findings on direct democracy are presented. In the first part, the authors show that, on average, public employees receive lower financial compensation under more direct democratic institutions. However, top bureaucrats are more constrained in direct democracies and have to be compensated by higher wages for that loss of power. In the second p...

Based on survey data for Switzerland, new empirical findings on direct democracy are presented. In the first part, we show that, on average, public employees receive lower financial compensation under more direct democratic institutions. However, top bureaucrats are more constrained in direct democracies and have to be compensated by higher wages for that loss of power. In the second part, we d...

The formal description of a novel process model has been introduced, that gives a common framework for the balance based conservational and rule based informational processes. The models are represented by a bilayered net (di-digraph) that determines also the network structures of influence routes and flux routes. In the direct computer mapping of these process models the balance elements and t...

-In flip-chip packaging an underfill mixture is placed into the chip-to-substrate standoff created by the array of solder bumps, using a capillary flow process. The underfill mixture is densely filled with solid silica particles to achieve the desired effective coefficient of thermal expansion. Thus during the flow process the underfill mixture is a dense suspension of solid particles in a liqu...