نتایج جستجو برای: آلیاژ لحیم ag cu
تعداد نتایج: 104151 فیلتر نتایج به سال:
Phialophora verrucosa is a dematiaceous fungus able to cause chromoblastomycosis, phaeohyphomycosis and mycetoma. All these fungal diseases are extremely difficult to treat and often refractory to the current therapeutic approaches. Therefore, there is an urgent necessity to develop new antifungal agents to combat these mycoses. In this context, the aim of the present work was to investigate th...
Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length...
A first step towards a microfabricated potentiometric thin-film sensor array for the simultaneous detection of Pb, Cd and Cu has been realized. The sensitive layers used are on the basis of chalcogenide glass materials. These thin-film chalcogenide glass materials that consist of mixtures of Pb-Ag-As-I-S, Cd-Ag-As-I-S or Cu-Ag-As-Se have been prepared by pulsed laser deposition technique. The d...
In this paper the EMC effect for Al, Fe, Cu, and Ag nuclei are investigated with oscillator model. In this model has been assumed that nucleons in each level are affected by different mean field, so we use parameter having relation with radius of each level. Therefore; this assumption causes that extracted data for average binding energy 22.48 MeV , 23.79 MeV , 29.56 MeV , and...
The structure of core-shell Cu@silica and Ag@Si nanoparticles obtained in one-step through evaporation of elemental precursors by a high-powered electron beam are investigated. The structure of the core and shell of the particles are investigated in order to elucidate their mechanisms of formation and factors affecting the synthesis. It is proposed that the formation of Cu@silica particles is m...
This study aims to understand how properties of modified aluminosilicate geomaterials influence the antibacterial performance nanocomposites when prepared with bimetallic nanoparticles (NPs). Copper/silver (Cu/Ag) NPs were synthesized in presence imogolite (Imo), montmorillonite (Mtt), or zeolite (Zeo) using a simple one-pot method and characterized for their crystal phases, micro- nanomorpholo...
During the fracture of nanocontacts gold spontaneously forms freely suspended chains of atoms, which is not observed for the isoelectronic noble metals Ag and Cu. Au also differs from Ag and Cu in forming reconstructions at its low-index surfaces. Using mechanically controllable break junctions we show that all the 5d metals that show similar reconstructions (Ir, Pt, and Au) also form chains of...
Ag-alloy bonding wires containing various Pd and Au elements and traditional 4 N Au and Pd-coated 4 N Cu bonding wires were stressed with a current density of 1.23 ˆ 105 A/cm2 in air. The amounts of annealing twins in the Ag-alloy wires were much higher than those in Au and Pd-coated Cu wires. The percentages of twinned grains in these Ag-alloy wires increased obviously with current stressing. ...
Engineering a bimetallic system with complementary chemical properties can be an effective way of tuning catalytic activity. In this work, CO oxidation on CeO2(111)supported Pd-based bimetallic nanorods was investigated using density functional theory calculations corrected by on-site Coulomb interactions. We studied a series of CeO2(111)supported Pd-based bimetallic nanorods (Pd−X, where X = A...
The intermetallic compounds formed during the diffusion soldering of a Bi2Te2.55Se0.45 thermoelectric material with a Cu electrode are investigated. For this bonding process, Bi2Te2.55Se0.45 was pre-coated with a 1 μm Sn thin film on the thermoelectric element and pre-heated at 250 ̋C for 3 min before being electroplated with a Ni barrier layer and a Ag reaction layer. The pre-treated thermoele...
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