Surface mounting technology is a key process in MEMS packaging. The finite element model of package structures was established in this paper according to the designed micromechanical silicon resonant accelerometer. The effects of package substrate materials, adhesive material characteristics, uneven adhesive thickness, and adhesive defects on the micromechanical silicon resonant accelerometer w...

The future trend of controller integrated circuit (IC) for micro hard disk driver (HDD) is to be lighter, thinner, shorter and smaller. The storage capacity and unit cost of micro HDD is lower than of flash memory card. The optimal packaging manufacturing process for driver IC for micro HDD is Chip Scale Package (CSP). However, the production and assemble process for CSP is much more difficult....

Machining of thin-walled (aluminium alloy) aerospace structures is a critical process due to the high warpage. Current practices in the fixture design and the choice of cutting parameters rely solely on conservative guidelines and the designer’s experience. This paper presents evaluation of clamping force to fix the work piecein aVacuum fixture using Vacuum pump. The ISCARonline calculator is u...

Penelitian ini dilakukan untuk mengetahui pengaruh temperatur mold terhadap perpindahan kalor dalam polimer dan pengaruhnya cacat produk yang terjadi pada kover dudukan pelat sepeda motor. Produk terbuat dari plastik diproduksi dengan metode injection molding. menggunakan software Autodesk Moldflow Adviser. Dari hasil penelitian tersebut diketahui bahwa sebesar 80.213,68 Joule temperature 30°C,...

In this paper we will present a mechanical study made on the design of thermal conductive plastic parts. Out our derived new rules that are useful for engineers have to create parts built from type materials. We used Catia V6 software modelling and ANSYS Moldflow simulate behaviour real components. The solutions resulted trials improving quality plastics. test simulation results lead us designi...

We introduce the double–double composite layup method and highlight its advantages over current industry standard method. Proof that (DD) can significantly reduce required number of plies in laminates therefore weight structures is provided. The 4-ply [± ??± ?] sub-laminates also make design manufacturing processes simpler less prone to error compared conventional (quad) layups. Layup homogeniz...