Three-dimensional (3D) integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked high power density layers of 3D CMPs increase the importance and difficulty of thermal management. In this paper, we investigate the 3D CMP run-time thermal management problem and describe efficient management techniques. Th...

Power semiconductor switching devices play an important role in the performance of high power wind energy generation systems. The state-of-the-art device choices in the wind power application as reported in the industry include IGBT modules, IGBT press-pack and IGCT press-pack. Because of significant deviation in the packaging structure, electrical characteristics, as well as thermal impedance,...

in this paper, the amount of wasted heat from different parts of a 12 liter compression ignition engine and their potential for waste heat recovery were investigated. then, two-stage configuration of organic rankine cycle was introduced for simultaneous heat recovery from exhaust gases and coolant. finally, parameters like hybrid generated power, engine thermal efficiency and brake specific fue...

When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design...

Thermal sensor characteristics and placement directly impacts the effectiveness and accuracy of full-chip thermal characterization necessary for dynamic thermal management (DTM) and reliable on-chip operation of multi/many-core chips. Temperature sensor characteristics widely vary in their area, power, and accuracy; the number of deployable sensors is constrained by the on-chip area/power const...

Thermal sensor characteristics and placement directly impacts the effectiveness and accuracy of full-chip thermal characterization necessary for dynamic thermal management (DTM) and reliable on-chip operation of multi/many-core chips. Temperature sensor characteristics widely vary in their area, power, and accuracy; the number of deployable sensors is constrained by the on-chip area/power const...

Finite element simulations have been conducted to determine the temperature distribution (both in radial and axial direction), heat and electric flux-field in the powder compact/die/punch assembly during the spark plasma sintering (SPS) process. A thermal–electrical coupled model with temperature dependent thermal and electrical properties is implemented. The simulation studies were conducted u...

The anisotropy of thermal lensing and the photo-elastic effect is characterized for diode-pumped Nd:KGd(WO4)2 crystals cut along the Np and Ng optical indicatrix axes and along its optical axis, O = Ng+43°, at a laser wavelength of 1067 nm. Distortions in the spatial profile of output laser beam are analyzed. The thermal lens is astigmatic; the orientation of its principal meridional planes, A ...

According to the demand of the power and refrigeration industry, the theoretical and practical teachings of the Thermal Energy and Power Engineering characteristic specialty in china are studied. The teaching reform and practice of the Thermal Energy and Power Engineering specialty have been carried out, including construction and reform measures, teaching reform and practice, features, and ach...

Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature management techniques. To combat these trends, we evaluate the thermal efficiency of the microcore architecture, a deeply decoupled processor core with larger structures factored out as helper engines. We further investigate ac...