This report shows the analysis of two essential processes in the integrated circuit fabrication: SiO2 growth and metal deposition. The first part consists of the characterization of dry and wet thermal oxidation. The idea is to obtain the parameters that describe the behavior of this process and use this to predict specific oxidation times and thicknesses. The second part consists of metal depo...

A noble low NOx combustion technology, based on partial oxidation combustion concept in a fuel rich combustion zone, is successfully applied in this research. The burner is designed such that a portion of fuel is heated and pre-vaporized in the furnace then injected into a fuel rich combustion zone so that a partial oxidation reaction occurs. The effects of equivalence ratio, thermal load, and ...

Since it is not known why sickle RBCs tend to undergo microvesiculation, we have investigated their susceptibility to thermal stress. While normal RBCs start to vesiculate at 49.0 +/- 0 degrees C (n = 14), sickle RBCs begin to vesiculate at 47.9 +/- 0.5 degrees C, with a range of 46.5 to 48.5 degrees C (n = 14). This abnormality is reproduced by treating normal RBCs with phenazine methosulfate ...

We have investigated the wet thermal oxidation of AlAs in cylindrical geometry, a typical configuration for vertical-cavity surface-emitting lasers. Through both experiment and theoretical calculations, we demonstrate a significantly different time dependence for circular mesas from what has been reported in the literature both in studies of stripes and in a study of circular mesas. We attribut...

We have studied the wet thermal oxidation of In0.52Al0.48As and its potential application in current and optical confinement in vertical cavity surface emitting lasers VCSELs . Two types of InP-based heterostructures were used to study the effect of adjacent layer compositions on the lateral oxidation behavior of the InAlAs. It was found that the oxidation of In0.52Al0.48As with InP adjacent la...

materials with high electrical and thermal conductivity, respectively with microstructural stability and high temperature strength, are very attractive for the electricelectronic industry and special machine building industry (actively-cooled parts, rocket nozzles, magnet wire and cables, welding electrode tips). copper is one of the most promising metals for these applications because it has t...

Spectroscopic evidence for an enhanced binding of Nitric Oxide (NO) to metal centers with lower oxidation states (open Cu(1+) sites) in Cu3(btc)2 (HKUST-1) is presented. The Cu(1+) sites created by thermal treatment or X-ray exposure exhibit a preferential adsorption of NO compared to H2O. This phenomenon demonstrates the potential use of MOFs with lower oxidation state metal centers for select...

This report shows the analysis of two essential processes in the integrated circuit fabrication: SiO2 growth and metal deposition. The first part consists of the characterization of dry and wet thermal oxidation. The idea is to obtain the parameters that describe the behavior of this process and use this to predict specific oxidation times and thicknesses. The second part consists of metal depo...

We find that nearly monodisperse copper oxide nanoparticles prepared via the thermal decomposition of a Cu(I) precursor exhibit exceptional activity toward CO oxidation in CO/O2/N2 mixtures. Greater than 99.5% conversion of CO to CO2 could be achieved at temperatures less than 250 degrees C for over 12 h. In addition, the phase diagram and pathway for CO oxidation on Cu2O (100) is computed by a...

The catalytic performance of Ni-Al, Mg-Al, and Co-Ni LDHs as novel nanocatalysts was evaluated in the oxidation of toluene. The samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Fourier transform infrared spectroscopy (FTIR). The XRD and FTIR approved the structure and functional groups of the LDH, respectively. Also, the presence of cations with dif...