Stencil computations are at the core of applications in many domains such as computational electromagnetics, image processing, and partial differential equation solvers used in a variety of scientific and engineering applications. Short-vector SIMD instruction sets such as SSE and VMX provide a promising and widely available avenue for enhancing performance on modern processors. However a funda...

Parallel Molecular Dynamics Stencil has been developed to execute effectively large-scale parallel molecular dynamics simulations. The Stencil is adapted to varieties of molecular dynamics simulations without special attention to parallelization techniques. As an example of large-scale simulation using this Stencil, the adiabatic elastic constants of solid argon in crystalline and amorphous sta...

Accelerators like the Intel Xeon Phi aim to fulfill the computational requirements of modern applications, including stencil computations. Stencils are finite-difference algorithms used in many scientific and engineering applications for solving large-scale and high-dimension partial differential equations. However, programmability on such massively parallel architectures is still a challenge f...

Stencil based computation on structured grids is a common kernel to broad scientific applications. The order of stencils increases with the required precision, and it is a challenge to optimize such high-order stencils on multicore architectures. Here, we propose a multilevel parallelization framework that combines: (1) inter-node parallelism by spatial decomposition; (2) intra-chip parallelism...

The importance of stencil-based algorithms in computational science has focused attention on optimized parallel implementations for multilevel cache-based processors. Temporal blocking schemes leverage the large bandwidth and low latency of caches to accelerate stencil updates and approach theoretical peak performance. A key ingredient is the reduction of data traffic across slow data paths, es...

Solder paste is the main soldering material used to form strong solder joints between printed circuit boards (PCB) and surface mount devices in the surface mount assembly (SMA). On average 60% of endof-line soldering defects can be attributed to inadequate performance of solder paste stencil printing. Recently, lead-free solder paste has been adopted by electronics manufacturers in compliance w...

SUMMARY We present a new nonlinear monotone finite volume method for diffusion and convection-diffusion equations and its application to two-phase black oil models. We consider full anisotropic discontinuous diffusion/permeability tensors and discontinuous velocity fields on conformal polyhedral meshes. The approximation of the diffusive flux uses the nonlinear two-point stencil which reduces t...

objective: the purpose of this study was to examine the impact of early family-centered psychological and educational interventions on adaptive behaviors in children with down syndrome (ds). method: utilizing an experimental pretest-posttest control group design, parents of 36 children with ds were selected in isfahan. vineland adaptive behavior scale was used to assess adaptive behavior. resul...