Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and high power ASIC and PLD. For these applications, both die and package dimensions are generally large. It is common to see dies over 25 mm and packages of 40 mm or larger. Therefore, warpage is a big challenge. A three-dimensional finite element model was developed to predict the wa...

background according to statistics of american society of plastic surgeons, cosmetic rhinoplasty was the second most frequently performed cosmetic surgery. this study shares the experiences with component rhinoplasty. methods from 2004 to 2010, all patients underwent aesthetic nasal surgery were enrolled. the patients requiring only correction of septal deviation and those presenting with cleft...

In the Multi-Spreader Crane Scheduling Problem (MSCSP), containers with identical dimensions but variable weights are arranged along a grid. A multi-spreader crane is used to lift all containers. The has m > 1 modes. When it in p th mode, can remove adjacent same row at time as long total weight of does not exceed loading capacity ? . Such takes h minutes. It also c , q minutes for switch from ...