Abstract Sn63Pb37/SAC305 mixed solder joint is inevitably in the electronic device requiring high reliability, such as health care, aerospace etc. However, usage history of relatively short and their interfacial behaviour reliability service has not been completely figure out. Herein, evolution microstructures fully BGA joints during high-temperature storage were systematically studied. After r...

In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...

0026-2714/$ see front matter 2013 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2013.03.014 ⇑ Corresponding author. Tel.: +1 416 978 5741; fax E-mail address: [email protected] (S.A. Me In this paper, we develop a new and computationally efficient multi-level approach to investigate board level drop reliability of printed circuit board (PCB) assembly. The approach is composed of two...

Nomenclature A new representation of engineering analysis models, termed product model-based analytical models (PBAMs) was introduced previously [Peak and Fulton, 1992b]. Since PBAMs link analysis information with detailed design information, they enable rapid, flexible analysis in support of product design. Nf average cycles to failure ∆ε p plastic cyclic strain range c fatigue ductility expon...

Measuring mechanical implications of high current densities in microelectronic packaging interconnects has always been a challenging goal. Due to small interconnect size this task has typically been accomplished by measuring the change in electrical resistance of the joint. This measurement parameter is global and does not give local mechanical state information. Also, understanding strain evol...

Abstract The fabrication process of WLP (wafer-level packaging) has become more mature, and using the finite element method (FEM) to predict reliability life electronic packaging can shorten design cycles. This study adopted NSMD (non-solder mask defined) solder joint structure in used an energy geometry. A fixed mesh size will be determined for critical region evaluate inelastic strain due the...

This paper investigates the failure mechanism of Fine-pitch Ball Grid Array (FBGA) solder joints of memory modules due to harmonic excitation by the experiments and the finite element method. A finite element model of the memory module was developed, and the natural frequencies and modes were calculated and verified by experimental modal testing. Modal damping ratios are also obtained and used ...

Microelectronic packaging plays an important role in cryogenic engineering; in particular, a solder joint as interconnection, which offers a mechanical, thermal and electrical support, undergoes much larger and harsher thermal changes during its service compared with conventional customer electronic products. The impact of thermo-mechanical properties of such solder joints under cryogenic servi...

Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/subs...