The design, materials, process, and fabrication of a hybrid substrate for the heterogeneous integration chips with 50μm-pitch (minimum) by fan-out chip-last panel-level packaging are presented. consists fine metal linewidth (L), spacing (S), thickness (H) RDL (redistribution-layer) substrate, solder joints underfill, build-up package substrate. dielectric material L/S/H RDL-substrate is an Ajin...

ABSTRACT Background: for treatment verification in radiation therapy. Several physical characteristics of ScanningLiquid filled Ionization Chamber EPID (SLIC-EPID) including: extra build-up layer,reproducibility and uniformity, and noise level were investigated.Electronic Portal Imaging Devices (EPIDs) have found an outstanding positionMaterials and Methods: equilibrium, 1-30 mm white water mat...