in this study, forced-vibration analysis of a coupled system of single layered graphene sheets (slgss) subjected to the moving nano-particle is carried out based on nonlocal elasticity theory of orthotropic plate. two slgss are coupled with elastic medium which is simulated by pasternak and visco-pasternak models. using hamilton’s principle, governing differential equations of motion are derive...

A three-dimensional mixed variational principle is used to derive a Kth-order two-dimensional linear theory for an anisotropic homogeneous piezoelectric (PZT) plate. Themechanical displacements, the electric potential, the inplane components of the stress tensor, and the in-plane components of the electric displacement are expressed as a Ž nite series of orderK in the thickness coordinate by ta...

In this work, an analytical study on the bending stiffnesses of corrugated board has been performed. Formulations to calculate the bending stiffnesses D11, D22, D12, and D66 of the equivalent plate representing the corrugated board have been established, and then compared to expressions suggested by other investigators. Several methods for modeling the shape of the corrugated orthotropic medium...

This paper presents a research work on stacking sequence design optimisation for multilayered composite plate using a parallel/distributed evolutionary algorithm. The stacking sequence of fibres has a dramatic influence on the strength of multilayered composite plates. Multiple layers of fibre-reinforced material systems offer versatility in engineering material design due to the fact that the ...

In this paper, a method of solution and some numerical resu~s of free vibration and buckling of composite laminates are presented. All the edges of the laminates are assumed as simply supported. Ritz's method of solution is used with deflection surface expressed in terms of double series in Chebyshev polynomials satisfying the simply supported laminate boundary conditions. The numerical results...

An accurate estimate of interfacial stresses in multi-layered microelectronic packaging is very important for design and prediction of delamination-related failures. An analytical model for stress analysis of multi-layered stacks, which is based on an extension of Valisetty s model (Bending of Beams, Plates and Laminates: Refined Theories and Comparative Studies, Ph.D. thesis, Georgia Institute...