Microstructured optical fibers can be precisely tailored for many different applications, out of which sensing has been found to be particularly interesting. However, placing silica optical fiber sensors in harsh environments results in their quick destruction as a result of the hydrolysis process. In this paper, the degradation mechanism of bare and metal-coated optical fibers at high temperat...

Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate load...

By restricting the dilated deformation, surface modification can stimulate multiple shear banding and improve the plasticity of bulk metallic glasses (BMGs). Aimed at modifying the surface of BMGs by thin layers, a crystalline Ni coating with ultrafine grains was coated on the surface of a Ti-based BMG by electroless plating. With a thickness of about 10 μm, the prepared thin coating could effe...

Abstract: Electroless Nickel (EN) composite coatings embedded with Cr2O3 and/or MoS2 particles were deposited to combine the characters of both Cr2O3 and MoS2 into one coating in this study. The effects of the co-deposited particles on corrosion behavior of the coating in 3.5% NaCl media were investigated. The results showed that both Ni-P and Ni-P composite coatings had significant improvement...

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni...

Electroless nickel (Ni) immersion gold (Au), commonly referred to by the acronym ENIG, is most common protective coating applied on exposed copper (Cu) traces of printed circuit boards (PCBs). In this work, we elucidate local corrosion mechanism ENIG-Cu system applying microscopic, surface analysis and electrochemical techniques with high spatial resolution provide a comprehensive understanding...