Abstract Stress shielding is known to cause bone refracture or low healing rate in fractured bones. The numerical study of process a transverse tibia was conducted this research reduce the stress shielding. and strain on callus were evaluated when plates different metallic non-metallic biomaterials used. Time varying material properties applied, loading conditions coupled with callus. distribut...

austenitic stainless steels are extensively used in various applications requiring good corrosion resistance and formability. in the current study, the formation of nano/ ultrafine grained austenitic microstructure in a microalloyed aisi 304l stainless steel was investigated by the advanced thermomechanical process of reversion of strain-induced martensite. for this purpose, samples were subjec...

Abstract Nano-Al 2 O 3 dispersion-strengthened Cu20W composite was fabricated by vacuum hot-pressing sintering process. The electrical conductivity, relative density, and Brinell hardness were tested, respectively. gleeble-1500D thermomechanical simulator used to conduct isothermal compression with strain rates ranging from 0.001 10 s −1 the temperatures 650 950°C. microstructure of Cu–Al /20W ...

Abstract In the study of plastic flow and mechanical features zinc subjected to severe deformation at low temperature through KOBO extrusion method, three techniques micro nanostructure identification have been used (TEM, STEM, HAADF). It was shown that pattern long trails—a typical element microstructure after deformation, results from strain fields densely spaced nano-dimensional clusters poi...

The axial compressive strength of continuous fibres reinforced composite laminates is a key design parameter. Adding nano-fillers to polymer matrices should increase this property but failure modes may change with increasing the nano-filler content. Significant improvement observed It also shown that single experimental tensile test on ±45∘ coupons makes it possible estimate regardless Indeed, ...

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, thermal resistance cost. Aiming assess high-temperature reliability sintered nano-copper interconnection, this study characterized mechanical properties particles using nanoindentation tests. The...