A lithium niobate (LiNbO3)/silicon (Si) hybrid structure has been developed by the surface-activated bonding of LiNbO3 chips with gold (Au) thin film to Si substrates with patterned Au film. After organic contaminants on the Au surfaces were removed using argon radiofrequency plasma, Au-to-Au bonding was carried out in ambient air. Strong bonding at significantly low temperatures below 100◦C wi...

The concept of bonding as a positive youth development construct is reviewed in this paper. The goals are fourfold. First, theoretical perspectives of bonding are delineated. Secondly, the relationships among bonding to caregivers, friends, romantic partners, as well as teachers, and adolescents' positive developmental outcomes are reviewed. Thirdly, with theoretical and empirical support, a di...

Noncovalent interactions play an important role in many biological and chemical processes. Among these, hydrogen bonding is very well studied and is already routinely used in organocatalysis. This Short Review focuses on three other types of promising noncovalent interactions. Halogen bonding, chalcogen bonding, and anion-π bonding have been introduced into organocatalysis in the last few years...

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

Background: The old concept of total-etch/dry bonding has been superseded by total-etch/wet bonding, and later on by the self-etch systems. Manufacturers have introduced single bottle systems to be used in total-etch, self-etch, or selective-etch modes under both dry and moist conditions. The aim of this study was to evaluate shear bond strengths of three different dental adhesives under dry an...

Cu wire bonding is one of the hottest trends in electronic packaging due to the cost and performance advantages of Cu wire over Au wire. However, there are many challenges to Cu wire bonding, one of which is the increased stress transmitted to the bond pad during bonding. This high stress is not desirable as it leads to pad damage or cratering in the Si under the pad. Another issue is pad splas...

Chip-on-film (COF) technology has been developed for liquid crystal displays (LCD) due to its high yield capability in fine pitch products. In this study, a new COF thermosonic (TS) bonding process using anisotropic conductive adhesive and ultrasonic vibrations will be introduced. Si chips with 16 cylindrical Cu bumps (¤100μm) and polyimide (PI) film substrate with a thickness of 70 μm were pre...

The bonding strength between resin cement and posts is important for post and core restorations. An important method of improving the bonding strength is the use of various surface pretreatments of the post. In this study, the surfaces of zirconia (fiber) posts were treated by mechanical and/or chemical methods such as sandblasting and silanization. The bonding strength between the zirconia (fi...

This paper deals with modeling and optimization of the roll-bonding process of Ti/Cu/Ti composite for determination of the best roll-bonding parameters leading to the maximum Ti/Cu bond strength by combination of neural network and genetic algorithm. An artificial neural network (ANN) program has been proposed to determine the effect of practical parameters, i.e., rolling temperature, reduction...

accumulative roll-bonding (arb) is a severe plastic deformation process that is using rolling to produce ultrafine grains in coarse grained metallic materials. in this study, arb has been applied on 70/30 brass up to 6 cycles at ambient temperature and non-lubricated conditions to apply a true strain up to 4.8 von mises strain. microstructures of arbed brass samples were characterized by scanni...