BACKGROUND The ability to withstand thermal stress is considered to be of crucial importance for individual fitness and species' survival. Thus, organisms need to employ effective mechanisms to ensure survival under stressful thermal conditions, among which phenotypic plasticity is considered a particularly quick and effective one. METHODOLOGY/PRINCIPAL FINDINGS In a series of experiments we ...

Ahstraet--ln many cooling situations, permanent attachment of fins to heat dissipating devices is undesirable yet htrge mechanical loads, important in reduction of thermal contact resistance, are not permitted. This work considers the interface between a low-force pressed-on fin and a heat source in boiling heat transfer; the thermal contact resistance and how the interface region may be used t...

Thermotolerance, transient resistance to heat induced by heat itself, is generally thought to be linked to the accumulationof heat-shock proteins in eukaryotic cells. The induction of thermotolerance and the synthesis of heat-shock proteins in primary and passage cultures of bovine aortic endothelium, passage cultures of bovine brain capillaries, and passage cultures of rat epididymal capillari...

Abstract: In this research, the oxidation behaviour of high Aluminum heat resistant steel (%25Cr,%20Ni,%8Al) hasbeen evaluated at the temperature range of (1000-1300ºC).The results showed that there was no countinous healinglayer on the surface of the alloy when Al increased up to %5.5 and the oxidation resistance of steel decreased due toformation of spinel oxides on the surface.By increasing ...

Advanced lines of Pima cotton {Gossypium barbadense L.) bred for higher yield potential and heat resistance have higher stomatal conductance and smaller leaf areas than those of obsolete !ines. In controlled experiments, five commercial lines of Pima cotton having increasing lint yield and heat resistance showed a gradient of increasing stomatal conductance and decreasing leaf size. In field ex...

By using multiple high-power LEDs in products, some difficulties occur in predicting the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-chip LED module, solid physical models for both single-chip and multi-chip LEDs with cooling fins were constructed. Simulation of the temperature dis...