نتایج جستجو برای: especially from itscultural aspect
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What makes some acts immoral? Although Western theories of morality often define harmful behaviors as centrally immoral, whether this is applicable to other cultures is still under debate. In particular, Confucianism emphasizes civility as fundamental to moral excellence. We describe three studies examining how the word immoral is used by Chinese and Westerners. Layperson-generated examples wer...
the present study aimed at exploring cognitions of iranian english teachers within the context of english for academic purposes (eap). to this end, the cognitions of two groups of eap teachers with respect to their pedagogical content knowledge (pck) and their sense of professional identity (pi) were probed. two language teachers and two content instructors who had at least five years of eap te...
in this thesis, a new optically active poly(amide-imide) (pai) was synthesized by the indirect polycondensation reaction of the l-phenylalanine based diacid chloride and 4,4?-diaminodiphenylether in the presence of triethylamine in n-methyl-2-pyrrolidone. the formation of pai was confirmed by ftir, 1h nmr and elemental analysis. in next step, the surface of titanium dioxide (tio2) nanoparticles...
Urban traffic control of modern cities, especially at intersections, has always been a crucial aspect of human civilization. In fact, the phenomenon of traffic congestion has become predominant due to the rapid increase in the number of vehicles and in the transportation demand. Especially over the last decade, traffic congestions have attracted great attention because of the worldwide energy c...
The idea behind Aspect-Oriented Modeling (AOM) is to apply aspect-oriented techniques to (software) models with the aim of modularizing crosscutting concerns. This can be done within different modeling notations, at different levels of abstraction, and at different moments during the software development process. This paper demonstrates the applicability of AOM during the software design phase ...
Introduction Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSV) for chip stacking, but also for other integrated Sitechnology. Especially in applications with a low number (<100 mm) of relatively large (10-20 μm diameter), high aspect ratio (1:5-1:20) interconnects, conventional wafer level plating processes are slow and become cu...
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