An eosinophilic substance is usually observed in the mouse nasal septum, and its volume increases with age. In contrast to descriptions in textbooks defining the eosinophilic substance as amyloid, our previous report revealed that the observed eosinophilic substance is not amyloid, but consisted of collagen and an amorphous material. Furthermore, it was suggested that the amorphous material was...

In the current economic situation, with a liberalized and worldwide trade, the weight of time and costs reduction for developing new products increases. In particular, the tooling processes, which are already expensive and time consuming, recently became a critical trouble. The geometric complexity, the number of variants and the amount of requirements that characterize the products that are re...

Abstract A laser deposition process involves the supply of metallic powders into a laser-heated spot where the powder is melted and forms a melt puddle which quickly solidifies into a bead. In order to design an effective system, the laser beam, the powder beam, and their interactions need to be fully understood. In this paper, the laser-material interaction within the melt pool is reported usi...

In contrast to the traditional chemical vapor deposition technique under high vacuum, we introduce a deposition method in liquid to prepare Pt patterns on substrate near 100 °C by seed growth.

The aim of the present research is to convert bioinert surface of NiTi to bioactive and biocompatible surface. In order to develop a bioactive and corrosion resistant film on NiTi, electrophoretic deposition process was done and TiO2 particles were deposited on the NiTi surface. Suspensions including TiO2 particles were prepared using a mixture of acetone and n-butanol (0%, 30%, 60%, 80% and 10...

We present a comparison of models describing the pyrolytic deposition of SiO2 with a low pressure chemical vapor deposition process. In order to meet industrial simulation requirements, e.g. accuracy and fast delivery of results, we present an overview of established and new models, their use within TCAD applications, and their best results which have been obtained by calibrations according to ...

Metal sputter deposition processes for semiconductor manufacturing are characterized by a decrease in deposition rate from run to run as the sputter target degrades. The goal is to maintain a desired deposition thickness from wafer to wafer and lot to lot. Run by run (RbR) model-based process control (MBPC) has been applied to metal sputter deposition processes at Texas Instruments. RbR MBPC, b...

Layered Manufacturing (LM) techniques build a part by adding thin layers of material. In many LM processes overhangs require the deposition of sacrificial supports resulting in an increase in the build time, wastage of material and costly post-processing. This has led to the development of LM systems which can deposit material along multiple directions and eliminate the need for supports. We su...

The deposition of yttria-doped zirconia has been experimented systematically in various types of porous ceramic substrates by a modified chemical vapor deposition (CVD) process operating in an opposing reactant geometry using water vapor and corresponding metal chloride vapors as reactants. The effects of substrate pore dimension and structure, bulk-phase reactant concentration, reactant diffus...

This paper presents a systematic numerical investigation of the transient transport phenomenon during the pileup of molten metal droplets on the substrate. The physical mechanisms of the pileup process, including the bulk liquid, capillarity effects at the liquid-solid interface, heat transfer, and solidification, are identified and quantified numerically. The droplet diameter is 100 μm, and th...