Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...

In acute toxicity (96 hr) experiment the fingerlings of freshwater fish Labeo rohita was exposed to tannery, electroplating and textile mill effluents. The LC0 and LC50 concentrations were 15% and 20% for tannery effluents, 3% and 6% for electroplating effluents and 18% and 22% for textile mill effluents respectively. It was found that, electroplating effluent was more toxic than tannery and te...

Abstract In the current study, electrolytic deposition using two different electrodes, copper (Cu) and nickel (Ni) was investigated with aim of protecting worn surface during mechanical sectioning polishing, for a posterior examination sub-surface microstructure. The efficacies coatings were visually assessed based on its adhesivity ability to protect wear tracks an as-cast 26% Cr high chromium...

To solve the environment pollution problem by toxic heavy metal contamination resulting from human technological activities has for long presented a challenge. Electroplating industries poses a major contribution to heavy metal pollution to environment. Since the process of biosorption has many attractive features compared to the conventional effluent treatment methods in electroplating industr...

This study was conducted to improve four characteristics as objectives:（1） high current efficiency, （2） surface brightness, and （3） hardness of chromium-carbon （Cr-C） alloy layers during electrochemical deposition from Cr（III） ions, （4） reproducibility the Cr-C layer formation repeated plating with a electroplating bath. A malonic-acid-containing sulfuric acid bath （sulfuric II） prepared by add...