نتایج جستجو برای: chip optical interconnects

تعداد نتایج: 315995  

2000
David Miller

Future enhancement of system performance will decreasingly rely on reduction in transistor dimensions. Rather, performance gains will increasingly come from improved hardware and software architectures and emerging technologies such as optical interconnects which provide a new design-space for system designers. It is possible that hybrid opto-electronic interconnects may revolutionize system im...

2007
Jamesina J. Simpson

As clock rates continue to rise, problems with signal integrity, cross-coupling,and radiation may render impractical the baseband metallic interconnects presently used in computers. In fact, because clock rates approaching microwave frequencies of 20 GHz areprojected by 2010, attention is being drawn toward alternative technologies that have relativelyfavorable signal transmission c...

Journal: :Science 2021

Chip-based frequency combs The realization of optical combs, light sources with precisely spaced frequencies across a broad spectrum wavelengths, in dielectric microresonators has affected range applications from imaging and ranging to precision time keeping metrology. Xiang et al. demonstrate that the entire system, laser-pumping system comb-generating microresonators, can be combined into an ...

2010
Ankit More Baris Taskin

Wireless interconnects are built with two or more antennas on a semiconductor integrated circuit (IC) communicating with each other to form an intra-chip communication network. The wireless interconnects are considered a viable solution to the global communications problems faced by ICs. In this work, the effects of the electromagnetic coupling between the on-chip antennas for wireless intercon...

2011
Jeffrey Chou Jeffrey Brian Chou

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2004
Ömer Oralkan A. Sanli Ergun Ching-Hsiang Cheng Jeremy A. Johnson Mustafa Karaman Thomas H. Lee Butrus T. Khuri-Yakub

This paper presents the first volumetric images obtained using a 2D CMUT array with throughwafer via interconnects. An 8×16-element portion of a 32×64-element array flip-chip bonded onto a glass fanout chip was used in the experiments. This study experimentally demonstrates that 2D CMUT arrays can be fabricated with high yield using silicon micromachining processes, individual electrical connec...

2017

As technology advances to giga-scale integration level, global interconnect resource becomes increasingly valuable in a VLSI chip. This is due to the exponential growth of the total number of interconnects/wires as the feature size of MOS transistors decreases in scaled deep submicron CMOS technologies. Interconnect length, however, has not scaled down with feature size and remains long relativ...

Journal: :Computing in Science and Engineering 2003
James D. Meindl

COMPUTING IN SCIENCE & ENGINEERING In the 20th century, mainstream electronics evolved from vacuum tubes and discrete copper wires to individual transistors and batch-fabricated, printed wiring boards to its current form, which integrates more than a billion transistors and copper interconnections in a single silicon chip. Until the past decade, designers benignly neglected the electrical perfo...

Journal: :IBM Journal of Research and Development 2007
Derrin M. Berger Jonathan Y. Chen Frank D. Ferraiolo Jeffrey A. Magee Gary A. Van Huben

As mainframes evolve and deliver higher performance, technologists are focusing less on processor speed and more on overall system performance to create optimized systems. One important area of focus for performance improvement involves chip-to-chip interconnects, with their associated bandwidths and latencies. IBM and related computer manufacturers are optimizing the characteristics of interco...

2008
Tapobrata Bandyopadhyay Gaurav Mehrotra Mahadevan K. Iyer P. M. Raj Madhavan Swaminathan Rao R. Tummala

This paper presents design and characterization of NanoCu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-onPackage.

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