نتایج جستجو برای: anodic etching

تعداد نتایج: 16935  

2012
Adriano Fonseca Lima Vinícius Brito da Silva Giulliana Panfiglio Soares Giselle Maria Marchi Flávio Henrique Baggio Aguiar José Roberto Lovadino

OBJECTIVES The aim of this study was to evaluate the (1) bond strength of a etch-and-rinse and self-etching adhesive systems to cavosurface enamel, (2) influence of the previous acid etching with phosphoric acid 35% to the self-etching adhesive application on bond strength values, and (3) analysis of the cavosurface enamel morphology submitted to different types of conditioning, with the use of...

Journal: :international journal of nanoscience and nanotechnology 2011
j. kaur s. singh r. kumar d. kanjilal sh. chakarvarti

in this paper, we have studied the electrical properties of the randomly distributed metallic (co and fe) nano/ micro wires on silicon substrate. deposition was carried out potentiostatically into the pores of the track-etch polycarbonate membrane spin coated onto the si substrate. spin coated films were irradiated with 150mev ni (+11) ions at a fluence of 8e7 ions/cm2, followed by uv irradiati...

Journal: :Lab on a chip 2013
Sertan Sukas Roald M Tiggelaar Gert Desmet Han J G E Gardeniers

This paper presents a method for the fabrication of integrated porous silica layers in microfluidic channel networks by microfabrication techniques. Porous silica is obtained by anodization of silicon, followed by full conversion of the porous silicon network into porous silica by means of thermal oxidation. A series of experiments were performed with various channel layouts to determine the cr...

2004
Tong Duy Hien Hien Duy Tong

An innovative process for the microfabrication of Pd-based membranes (Pd and Pd-Ag) on a <110> silicon wafer is presented. Pd-Ag alloy films containing 23wt% Ag are prepared by a dual-sputtering from pure Pd and Ag targets. In the first step, deep grooves are KOH etched in one side of a <110> oriented silicon wafer, leaving membranes with a thickness of ca. 50 μm. After Pd alloy deposition on t...

2016
Jangsun Hwang Mintai P. Hwang Moonhyun Choi Youngmin Seo Yeonho Jo Jaewoo Son Jinkee Hong Jonghoon Choi

Heavy metal pollution has been a problem since the advent of modern transportation, which despite efforts to curb emissions, continues to play a critical role in environmental pollution. Copper ions (Cu2+), in particular, are one of the more prevalent metals that have widespread detrimental ramifications. From this perspective, a simple and inexpensive method of detecting Cu2+ at the micromolar...

2015
Jana Drbohlavova Radim Hrdy Hana Kynclova Katerina Prikrylova Jaromir Hubalek

Abstract Noble metalllic electrodes, especially, gold, solid gold-amalgam, silver or palladium are very suitable for biological applications in the field of fragment biological samples detection such as microRNA or proteins as disease markers [1, 2]. Various nanostructured surfaces based on metallic nanopillars, nanorods or nanowires are usefull in microdevices . The present works deals with th...

2004
H. LUOTO T. SUNI M. KULAWSKI K. HENTTINEN H. KATTELUS

Polysilicon thick films have been found to be an irreplaceable option in various sensors and other microelectromechanical system (MEMS)-designs. Polysilicon is also a prospective option for replacing singlecrystal silicon in customized silicon-on-insulator-substrates. Due to the nature of polysilicon, bonding for MEMS-purposes has so far concentrated on anodic bonding, which has drawbacks for i...

2015
Zhao Yao Cong Wang Yang Li Nam-Young Kim

Highly ordered nanoporous anodic aluminum oxide (AAO) thin films were fabricated in oxalic acid under a constant voltage via a two-step anodization process. To investigate the high-aspect-ratio (7.5:1) filling process, both sputtering and atomic layer deposition (ALD) were used to form TiO2 nanowires. Field emission scanning electron microscopy and high-resolution transmission electron microsco...

2017
Marco Salerno Amirreza Shayganpour Barbara Salis Silvia Dante

Thin anodic porous alumina (tAPA) was fabricated from a 500 nm thick aluminum (Al) layer coated on silicon wafers, through single-step anodization performed in a Teflon electrochemical cell in 0.4 M aqueous phosphoric acid at 110 V. Post-fabrication etching in the same acid allowed obtaining tAPA surfaces with ≈160 nm pore diameter and ≈80 nm corresponding wall thickness to be prepared. The tAP...

Journal: :European journal of paediatric dentistry : official journal of European Academy of Paediatric Dentistry 2004
J R Boj A M Martín E Espasa O Cortés

AIMS These were to firstly evaluate the shear bond strength of a composite resin to primary dental enamel treated with a standard adhesive system but with varying phosphoric acid etching times along with a self-etching prime, secondly to analyse the etching patterns using SEM. METHODS Forty primary molars were used. In the first three groups, following acid etching, a layer of Prime & Bond NT...

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