نتایج جستجو برای: agglomerates

تعداد نتایج: 1221  

Journal: :Isij International 2021

Basic oxygen furnace (BOF) flue gas cleaning system is a crucial purification device to ensure the cleaner production in steelmaking process. Due utilization of galvanized steel scrap process, zinc-containing dust collected by forms unremovable high-strength agglomerates on inner wall evaporative cooler, which can affect normal operation and seriously hinder This issue continuously aggravates a...

Journal: :Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 2017

Journal: :Atmosphere 2022

Snow covers are very sensitive to contamination from soot agglomerates derived vehicles. A spectroradiometric system covering a wavelength 300 2500 nm with variable resolution (from 2.2 7.0 nm) was used characterize the effect of diesel vehicle whose exhaust stream oriented towards limited snowed area. The previously tested in rolling test bench where particle number emissions and size distribu...

2011
Łukasz Borowik Nicolas Chevalier Denis Mariolle François Bertin Eugenie Martinez Amal Chabli Jean-Charles Barbé

The dewetting of ultrathin silicon layers, induced by the thermal budget, is an issue to develop SOI-based technology. This study aims at demonstrating the effect of the strain on the dewetting mechanism [1] (Figure 1). For that purpose, we present the results obtained on (001) oriented ultrathin (<11 nm) silicon layers on silicon dioxide (SOI). Both stress-free and strained (s-SOI) films fabri...

2010
Laarnie Tumolva Ji-Yeon Park Jae-suk Kim Kihong Park Arthur L. Miller Judith C. Chow John G. Watson

The Transmission Electron Microscopy (TEM) and Energy Dis­ persive Spectroscopy (EDS) were used to determine morphology and elemental composition of a variety of freshly emitted soot par­ ticles (acetylene flame, candle flame, kerosene flame, diesel exhaust, electric arc, plastic burning, styrofoam burning, wood burning [white oak and pine bark], and rice straw burning), which can be possible c...

2000
YI-KAI HUANG Frederick Y. Huang M. J. Kushner

Dust particle contamination in plasma etching reactors continues to be a major concern to microelectronic device manufacturers. Dust particulates as small as tens of nanometers in dimension can produce killer defects on the substrate surface. These contaminants are produced either through gas-phase nucleation processes in the discharge, or through interaction with surfaces in the reactor. Their...

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