نتایج جستجو برای: آلیاژ لحیم ag cu
تعداد نتایج: 104151 فیلتر نتایج به سال:
Epitaxial Ag(001) layers were deposited on MgO(001) in order to study electron surface scattering. X-ray reflection indicates 3D layer nucleation with a high rms surface roughness of 1.0 nm for a layer thickness d1⁄4 3.5 nm. X-ray diffraction shows that f111g twins form at d< 11 nm, followed by 2nd generation twinning for 11 nm< d< 120 nm. Increasing the growth temperature from 25 to 150 C supp...
A new dispenser and scanner system is used to create and screen Bi-M-Cu oxide arrays for cathodic photoactivity, where M represents 1 of 22 different transition and post-transition metals. Over 3000 unique Bi : M : Cu atomic ratios are screened. Of the 22 metals tested, 10 show a M-Cu oxide with higher photoactivity than CuO and 10 show a Bi-M-Cu oxide with higher photoactivity than CuBi2O4. Cd...
The main focus of the current research is bio-nano-technologically produced nanoparticles (NPs) utilizing waste materials. There a need for developing advanced technology to reduce in an eco-friendly way. Therefore, presently discarded aqueous portion Prosopis cineraria pod was used after boiling, synthesize Ag and Ag–Cu NPs. FT-IR spectra illustrated presence phenyl propenoids flavonoids displ...
امروزه نیاز به اتصال آلومینیم به فولاد به منظور¬کاهش وزن سازه،¬¬ در صنایع¬ دریایی، هوافضا و خودرو¬سازی¬، به سرعت در حال افزایش است. در این تحقیق آلیاژ آلومینیم 5083 از طریق روش جوشکاری قوسی با گاز محافظ خنثی و الکترود تنگستنی (تیگ) - لحیم¬کاری سخت، به فولاد گالوانیزه، فولاد¬ زنگ ¬نزن و فولاد ساده کربنی با به کار بردن پرکننده¬ های پایه آلومینیم (al-5si)¬4043¬ و (al-12si)¬4047 اتصال داده شد. شبیه...
بریزینگ به فرآیندی گفته می شود که در آن اتصال از طریق حرارت دهی قطعه کار تا دمای مناسب(بالای 427 ) توسط فلز پرکننده با نقطه ذوب بیش از 427 درجه و کمتر از نقطه ذوب فلز زمینه که از طریق خاصیت موئینگی درز اتصال را پر می نماید، انجام می پذیرد. بریزینگ اتصالی متالورژیکی است که بر پایه ترشوندگی و نفوذ استوار است. بر این اساس و به منظور شناخت شرایط تر شوندگی سطح فولاد 321 aisi و تاثیر عواملی نظیر د...
Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped -Cu 6 Sn 5 and continuous planar -(Cu 0.9 Ni 0.1) 6 Sn 5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional -Cu 3 Sn intermetallic layer is formed at the interface betwee...
The reliability of wide-bandgap (WBG) semiconductors used as power electronics is closely related to the high thermal conductivity AlN-metalized substrates. Thus, bonding AlN ceramics with metals a key issue for production reliable This paper reports on new method producing AlN/Cu joints by employing novel film metallization process, which involves porous network Cu layer and Ag foil. microstru...
Concentrations of copper (Cu), silver (Ag), and cadmium (Cd) in eastern oysters (Crassostreu tirgkicu) from the upper Patuxent River estuary analyzed since 1986 (Cd since 1991) were high relative to concentrations in other sites in the United States analyzed by the National Oceanic and Atmospheric Administration National Status and Trends program. Patuxent River oysters had above average concen...
The classic metallurgical systems—noble-metal alloys—that have formed the benchmark for various alloy theories are revisited. First-principles fully relaxed general-potential linearized augmented plane-wave ~LAPW! total energies of a few ordered structures are used as input to a mixed-space cluster expansion calculation to study the phase stability, thermodynamic properties, and bond lengths in...
Pirquitasite, ideally Ag(2)ZnSnS(4) (disilver zinc tin tetra-sulfide), exhibits tetra-gonal symmetry and is a member of the stannite group that has the general formula A(2)BCX(4), with A = Ag, Cu; B = Zn, Cd, Fe, Cu, Hg; C = Sn, Ge, Sb, As; and X = S, Se. In this study, single-crystal X-ray diffraction data are used to determine the structure of pirquitasite from a twinned crystal from the type...
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