This paper reports on the feasibility of using surface mount technology (SMT) assembly processes and materials to produce highly parallel, high-aspect ratio microchannel arrays. Experimental results show that the fabrication of high-aspect-ratio (> 40:1) microchannel arrays is possible using solder paste, screen printing, and reflow bonding. A simple model and empirical examination verifies tha...

For laser assisted Shape Deposition Manufacturing (SDM), residual stresses caused by the temperature gradient and material property mismatches result in part inaccuracy, warpage, or even delamination. The use of low coefficient of thermal expansion (CTE) materials such as Invar promises to reduce deformations caused by internal stresses [2]. Thus, to obtain high quality of prototypes for moldin...

Injection molding has been the most popular method for making plastic products due to high efficiency and manufacturability. The injection molding process includes three significant stages: filling and packing stage, cooling stage, and ejection stage. Among these stages, cooling stage is very important one because it mainly affects the productivity and molding quality. Normally, 70%~80% of the ...

Failure of blind via is one of the main causes of an open circuit in printed circuit boards (PCBs). By using macroscopic and microscopic testing methods and characterization techniques, the failure analysis of the vias on PCB for novel mobile phones has been systematically carried out. Metallographic inspection shows obvious cracking along the interface of different copper layers. Micrograph ob...

Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the product on completion of the process and predicting the deformation with respect to the pressure ...