نتایج جستجو برای: ultra fine grain

تعداد نتایج: 223317  

2003
Seongmoo Heo Ken Barr Mark Hampton Krste Asanović

Previous work in leakage current reduction for digital circuits can be divided into two main categories: static design-time selection of slow, low-leakage transistors for non-critical paths and dynamic deactivation of fast leaky transistors on critical paths. Leakage power is dominated by critical paths, and hence dynamic deactivation of fast transistors could potentially yield large savings. W...

Journal: :J. Parallel Distrib. Comput. 2003
Gregory W. Price David K. Lowenthal

The rising availability of multiprocessing platforms has increased the importance of providing programming models that allow users to express parallelism simply, portably, and efficiently. One popular way to write parallel programs is to use threads for concurrent sections of code. User-level threads packages allow programmers to implement multithreaded programs in which thread creation, thread...

Journal: :Softw., Pract. Exper. 1992
Paul A. Johnson Ceri Rees

Object-oriented languages are often promoted as encouraging the production of flexible, reusable software. Unfortunately, experience suggests that although individual classes may be reusable, large class libraries seem to lack flexibility in the face of circumstances unforeseen by the designer. This paper explores the problems associated with flexibility and reuse in large libraries, and shows ...

1993
Shumeet Baluja

One of the issues in creating any search technique is balancing the need for diverse exploration with the desire for efficient focusing. This paper explores a genetic algorithm (GA) architecture which is more resilient to local optima than other recently introduced GA models. and which provides the ability to focus search quickly. The GA uses a fine-grain parallel architecture to simulate evolu...

1994
Dawson R. Engler Gregory R. Andrews David K. Lowenthal

It has long been thought that coarse-grain parallelism is much more efficient than fine-grain parallelism due to the overhead of process (thread) creation, context switching, and synchronization. On the other hand, there are several advantages to fine-grain parallelism: architecture independence, ease of programming, ease of use as a target for code generation, and load-balancing potential. Thi...

2006
Shen J. Dillon Martin P. Harmer

Ultra-high purity alumina was sintered in hydrogen at temperatures ranging from 13251 to 20201C. Normal grain growth was maintained in all samples and grain boundary mobilities were measured. The data represent the most complete measure of intrinsic grain boundary mobility for alumina grain growth currently available. There are two orders of magnitude of discrepancy between the calculated and m...

1993
Dawson R. Engler Gregory R. Andrews David K. Lowenthal

It has long been thought that coarse-grain parallelism is much more efficient than fine-grain parallelism due to the overhead of process (thread) creation, context switching, and synchronization. On the other hand, there are several advantages to fine-grain parallelism: architecture independence, ease of programming, ease of use as a target for code generation, and load-balancing potential. Thi...

2010
Lubomír Čížek

During last two decades great attention was paid to materials with grains of diameter smaller than 1 μm. These materials were classified as Ultra Fine Grain (UFG) materials with diameter of grains of the order of 100 to 1000 nm and nano-materials with mean diameters of grains smaller than 50 nm. This research concerned the whole production of UFG materials, using Severe Plastic Deformation (SPD...

2015
Zhideng Wang Ning Li Minghao Wang Xiyu Wang Deyu Li Dana Havas Hanguang Zhang Gang Wu

In this work, a new type of block co-polymer additive, PE9400, was investigated for electrodepositing an ultra-low Sn coating in methanesulfonic acid (MSA) electrolyte. A thin coating with a loading of 0.7 gm 2 tin was fabricatedwith excellent uniformity and coverage on wet temper rolling steel (WTRS), when PE9400was used as an additive in the plating bath. Electrochemical measurements, real el...

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