نتایج جستجو برای: tsv
تعداد نتایج: 599 فیلتر نتایج به سال:
For the purpose of the sustainable development in the global semiconductor industry, emerging three-dimensional integrated circuit (3DIC) integration technologies have demonstrated their importance as potential candidates for extending the lifespan of Moore’s Law. This study aimed to explore a technology selection process involving a three-stage fuzzy multicriteria decision-making (MCDM) approa...
Corresponding author: Tel: 005511 3726-7222; ext 2231 Fax: 005511 3726-1505 E-mail: [email protected] AIMS: The effects of Tityus serrulatus venom (TSV) were analysed with respect to the susceptibility of four isogenic mouse, the symptoms following injection of venom and the inflammatory mediators in an experimental model of severe envenomation induced in mice. Methods : The susceptibility ...
AIMS The effects of Tityus serrulatus venom (TSV) were analysed with respect to the susceptibility of four isogenic mouse, the symptoms following injection of venom and the inflammatory mediators in an experimental model of severe envenomation induced in mice. METHODS The susceptibility was analysed by lethal dose (LD50) determination, including the symptoms observed during envenomating and g...
Test Scheduling and Test Access Optimization for Core-Based 3D Stacked ICs with Through-Silicon Vias
In the race against Moores Law, integrated chips (ICs) with multiple dies stacked over one another and connected by ThroughSilicon Vias (TSVs), called 3D TSV-Stacked ICs (SICs) have attracted a fair amount of research [1]–[5]. Due to imperfections in IC manufacturing, each individual chip must be tested. Testing each IC, increases cost, which is highly related to the testing time spent on each ...
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.11.001 ⇑ Corresponding author. E-mail address: [email protected] (Y.-L. Shen). Thermo-mechanical reliability is an important issue for the development and deployment of the throughsilicon-via (TSV) technology in three-dimensional (3D) microelectronic packaging. The mismatch in coefficient of thermal expansion (CTE) betwe...
PURPOSE The 2.2-mm microincision cataract surgery and small-gauge vitrectomy system is known to result in less surgically-induced astigmatism (SIA) in comparison to conventional surgical methods. We compared the amounts of SIA after combined phacoemulsification and 23-gauge transconjunctival sutureless vitrectomy (23G-TSV) using the 2.2-mm microincision and 2.75-mm standard incision methods. ...
Three dimensional integrated circuits (3D IC) is an emerging technology to overcome the interconnect delay and power limitations. A 3D IC consists of two or more independently manufactured ICs that are vertically stacked on top of each other this is referred to as a tier. An interconnection between the tiers is made by through-silicon vias (TSV). Three dimensional (3D) ICs are capable of achiev...
It is well known that in the computation of Gröbner bases arbitrarily small perturbations in the coefficients of polynomials may lead to a completely different staircase, even if the solutions of the polynomial system change continuously. This phenomenon is called artificial discontinuity in Kondratyev’s Ph.D. thesis. We show how such phenomenon may be detected and even “repaired” by using a ne...
Scorpions belonging to the Tityus genus are of medical interest in Brazil. Among them, Tityus stigmurus is the main scorpion responsible for stings in the Northeast region. After a sting, the scorpion venom distributes rapidly to the organs, reaching the kidneys quickly. However, there are few studies concerning the renal pathophysiology of scorpion poisoning. In this study, we evaluated the ef...
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