Existing methods for visual recognition based on quantized local features can perform poorly when local features exist on transparent surfaces, such as glass or plastic objects. There are characteristic patterns to the local appearance of transparent objects, but they may not be well captured by distances to individual examples or by a local pattern codebook obtained by vector quantization. The...

We have fabricated transparent top-gate ZnO nanowire (NW) field effect transistors (FETs) on glass and measured their trap density-of-states (DOS) at the dielectric/ZnO NW interface with monochromatic photon beams during their operation. Our photon-probe method showed clear signatures of charge trap DOS at the interface, located near 2.3, 2.7, and 2.9 eV below the conduction band edge. The DOS ...

A simple approach to producing a 1×N beam splitter is demonstrated by fabricating a volumetric multiplex phase Fresnel zone plate in bulk transparent material. This comprised four layers of zone plates created in borosilicate glass by femtosecond laser direct-writing, each shifted laterally relative to the illumination axis, creating four separate beamlets. Since the power transmitted in each b...

Electrochromic devices (ECDs) containing iron-based metallo-supramolecular polymers (Fe-MEPE) and Prussian blue (PB) as electrode materials, polymer electrolyte flexible ultra-thin ITO glass transparent conductive substrate are demonstrated.

Transparent oxyfluoride glass-ceramics (GCs) containing KLaF4 nanocrystals (NCs) doped with Nd3+were prepared by Spark Plasma Sintering (SPS). Glass powder pellets were sintered under a vacuum atmosphere, optimizing the processing parameters such as particle size, pressure, temperature, and holding time to obtain full densification. Transparency decreased when decreasing size due higher carbon ...

The purpose of this study was to evaluate the surface hardness of a resin composite (TPH) polymerized with and without the use of a transparent light-curing cone. Twenty composite blocks were made on a Teflon mold with cylindrical holes of 3 mm depth and 6 mm radius, and were light cured following different procedures. Group 1: Ten samples were pressed with a glass slide and light cured for two...

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requi...