In this study, a model for estimating the NFs thermal conductivity by using a GMDH-PNN has been investigated. NFs thermal conductivity was modeled as a function of the nanoparticle size, temperature, nanoparticle volume fraction and the thermal conductivity of the base fluid and nanoparticles. For this purpose, the developed network contains 8 layers with 2 inputs in each layer and also tra...

An approach fofsr data-driven modelling of open sorption storage systems using zeolite as material is presented. The overall dynamic simulation model has the inflow air stream mass flow and absolute humidity inputs computes outflow temperature. sub-divided into several components, where state space process identification techniques are applied. A comparison proposed technique with simulated dat...

Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non-negligible impact on delay and reliability is getting significant attention lately. One of the principal factors affecting designs today is timing criticality, which, in today’s technologies is mostly determined by wi...

The low thermal conductivity of the prototype hydrogen storage adsorbent, metal-organic framework 5 (MOF-5), can limit performance in applications requiring rapid gas uptake and release, such as in hydrogen storage for fuel cell vehicles. As a means to improve thermal conductivity, we have synthesized MOF-5-based composites containing 1e10 wt.% of expanded natural graphite (ENG) and evaluated t...

a r t i c l e i n f o Keywords: COB package Silicon sub-mount LED package Thermal resistance In this paper, the cost of a light emitting diode (LED) package is lowered by using a silicon substrate as the base attached to the chip, in contrast to the conventional chip-on-board (COB) package. In addition we proposed an LED package with a new structure to promote reliability and lifespan by maximi...