Single crystals formed from hydrogen-bonding supramolecular cations of o-aminoanilinium (HOPD)­crown ethers, (HOPD)([12]crown-4), (HOPD)([15]crown-5), and (HOPD)([18]crown-6), and one-electron-reduced [PMo12O40] Keggin-type clusters were synthesized. The crystal structures and dielectric responses of the three new compounds (HOPD)4([12]crown-4)4[PMo12O40]¢4CH3CN (1), (HOPD)4([15]crown-5)4[PMo12...

Low-temperature germanium to silicon wafer bonding was demonstrated by in situ radical activation and bonding in vacuum. After low temperature direct bonding of Ge to Si followed by annealing at 200 and 300 C, advanced imaging techniques were used to characterize the bonded interface. The feasibility of transferring hydrogen-implanted germanium to silicon with a reduced thermal budget is also d...

Applications that exploit the exceptional properties of carbon nanotubes CNTs at practical length scales almost invariably involve the fundamental issues of nanotube-to-surface contacts; indeed, interface properties often dominate mechanical, electrical, and thermal performance in devices and materials based on CNTs. In this paper we present a method to attach CNTs to glass surfaces and investi...

We report a low-temperature wafer bonding method for the realization of integration of GaAsand InP-based optoelectronic devices with Si microelectronic devices. This method uses a Au-Ge eutectic alloy as the bonding material sandwiched between GaAs and Si wafers, and between InP and Si wafers. The bonding process was carried out at 280-300 “C by taking advantage of the low-temperature solid-sta...

We have examined the bonding and orientation of thiophene on Mo(100) following chemisorption at 180 K. At these temperatures, thiophene adsorbs predominantly molecularly, and a shift in the binding energy of peaks due to molecular a-orbitals in the photoelectron spectrum suggests that at least part of the bonding of the thiophene molecule to the surface involves these orbitals. Measurements of ...

-Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area is outlined. Some work concerned with the bonding modeling is also presented. This model is based...

OBJECTIVES This study investigated the shear bond strength (SBS) and the tensile bond strength (TBS) of the zirconia-to-resin interface using different cement bonding concepts. METHODS Coplanar zirconia specimens were bonded to CoCr-cylinders measuring 5 mm in diameter and 3 mm in height. All bonding areas were first sandblasted with 110 μm Al(2)O(3) (0.28 MPa, 10 s). SBS and TBS were determi...

Non-thermal atmospheric pressure plasmas (NT-APPs) have been shown to improve the bond strength of resin composites to demineralized dentin surfaces. Based on a wet-bonding philosophy, it is believed that a rewetting procedure is necessary after treatment with NT-APP because of its air-drying effect. This study investigated the effect of 'plasma-drying' on the bond strength of an etch-and-rinse...

Developing an accurate model for MEMS devices and structures is a great asset for future design optimization and provides insight into experimental results. A thermal conductivity pressure sensor was microfabricated to evaluate the success of a glass frit vacuum packaging scheme. The sensor and the package dimensions present classical size effects that must be included in the model for accuracy...