Eutectic AuSn20 solder is an important material for electronic packaging technology due to its superior mechanical and thermal conductive properties. In this work, AuSn20 alloy films are prepared via the electrodeposition method for the first time. The electrodeposition is cost-effective with improved control over the alloy content when compared to traditional powdered metallurgy methods. Pyrop...

Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The mechanism of substrate flexibility on improving solder joint thermal fatigue was investigated by thermal mechanical an...

This paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semiimplicit time-integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into nite element codes developed at Sandia National L...

The quality of surface mount technology (SMT) product solder joint was key factor for SMT products. In this paper, for chip components, a fuzzy fault diagnosis principle of SMT products was analyzed. And the total framework of fault diagnosis system was built based on solder joint shape theory. Geometrical shape parameters which reflected chip components solder joint quality were analyzed and d...

Abstract A goal of advanced packaging design performance is to reduce power and achieve better control heat electromagnetic interference. Materials efficient include the use gold (Au) wire, copper (Cu) alloy, gold/silver (Au/Ag) plating, solder, low-k epoxy dry-film polymers, silicones polyimides. Material purity verification contamination during production process a prerequisite ensure high yi...

In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of on the thermodynamic properties, wettability, interface microstructure, and soldering performance Sn35Bi0.3Ag–xIn/Cu joints were studied synchrotron thermal analyzer (DSC), contact-angle measuring instrument, scanning electron microscope (SEM), ener...

In this article, technology for producing wire and rod solder from 52In-48Sn alloy has been developed investigated in the conditions of small-scale production. The use direct extrusion rods instead traditional solder, which includes pressing, rolling drawing, can significantly reduce fleet required equipment. Using only a melting furnace hydraulic press, wires be produced various sizes. Shorten...

Due to the consideration of environmental protection policy, all electronic products are requested to be lead free. In package field, solder ball is also requested to be lead free and currently the most popular type of solder ball is the Sn/Ag/Cu solder [1]. Sn/Ag/Cu solder has higher melting point and weaker wettability [2-3] during IR re-flow profile than eutectic solder ( Sn/Pb ), therefore ...

The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...

The research summarized in this paper will help to address some of the issues associated with solder paste mass reflow assembly of 0201 components. Attachment pad design, stencil design, component to component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were...